AMD CEO Zifeng Su to visit TSMC in person: hold on to 3nm, 2nm.

According to foreign media reports, AMD CEO Su Zifeng will visit Taiwan Province of China in the next few months to visit a number of partners, especially TSMC.

It is reported that Su Zifeng will meet with TSMC president Wei Zhejia, focusing on manufacturing process cooperation, wafer capacity supply issues, such as the future of 3nm, 2nm.

It is not clear which generation of AMD products will use these advanced processes, the current roadmap is only clear to 5nm Zen4 CPU, RDNA3 GPU, it is estimated that the next stop Zen5, RDNA4 is very promising.

At the same time, ZF Su will also discuss advanced packaging technologies, such as CoWoS (wafer substrate chip) and FO-EB (fan-out embedded bridge) with TSMC, SPIL (Silicon Power) and Sunrise (ASE).

In addition, Asus, Acer, Xiang Shuo and other manufacturers Su Zifeng will also take a trip, of which Xiang Shuo is the AMD chipset manipulator, especially it is said that after the future retirement of the X570, AMD all chipsets will come from the hands of Xiang Shuo.

In short, Su Zifeng's trip will be very busy, will also have a significant impact on the future development of AMD. $Advanced Micro Devices(AMD.US)$ $Taiwan Semiconductor(TSM.US)$
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