Apple's next-generation chip strategy: Will adopt 2nm process and WMCM packaging in the iPhone 18 in 2026.

October 16, 2024 (excerpt)

In the upcoming iPhone 18 series in 2026, Apple aims to push forward at the forefront of semiconductor technology. According to reliable sources, Apple is planning for significant performance improvements by adopting TSMC's next-generation 2nm manufacturing process, incorporating new packaging technology, and 12GB of RAM.

The adoption of 2nm process technology in Apple's latest generation iPhone brings significant improvements in processing performance and power efficiency. Additionally, the new WMCM (Wafer-Level Multi-Chip Module) packaging technology, by highly integrating multiple chips, holds the potential to dramatically enhance the overall system performance.

The upgrade to 12GB of RAM would be good news for many users. By increasing from the current 8GB to 50%, it is expected that multitasking and AI processing capabilities will significantly improve.
Driving this is TSMC, leading the forefront of semiconductor manufacturing. The company is currently dedicating full efforts to developing 2nm process technology. This innovative manufacturing process is scheduled to begin mass production in the second half of 2025. And it seems that the first to benefit from this will be none other than Apple.