[Earnings Preview] Is AMD's Growth Still Ahead? Focus on the new 2.5/3D AI chip
● $Advanced Micro Devices (AMD.US)$ IsJanuary 31 at 7:00 (Japan Time)We plan to announce financial results for the 23Q4 (fiscal year ending 10-12).
●The market is 23Q4turnoverBut$6.139 billion, up 9.64% year over year、PESBut$0.26, up 2498.00% year over yearExpected.
●80.00%The analyst has a bullish rating,The average target share price is $157.23。
● The new 2.5/3D AI chip is attracting attention.
●The market is 23Q4turnoverBut$6.139 billion, up 9.64% year over year、PESBut$0.26, up 2498.00% year over yearExpected.
●80.00%The analyst has a bullish rating,The average target share price is $157.23。
● The new 2.5/3D AI chip is attracting attention.
Sales for 23Q4 are expected to increase 9.64% from the same period last year to 6.139 billion dollars, and EPS is expected to increase 2498.00% from the same period last year to $0.26
According to Moomoo, the market expects sales for 23Q4 to be 6.139 billion dollars, up 9.64% from the same period last year, and EPS to 0.26 dollars, up 2498.00% from the same period last year.
According to Moomoo, the market expects sales for 23Q4 to be 6.139 billion dollars, up 9.64% from the same period last year, and EPS to 0.26 dollars, up 2498.00% from the same period last year.
80.00% analysts have bullish ratings, and the average target share price is $157.23
According to Moomoo, the average target stock price presented by analysts is $157.23, which is about 13% lower than the current situation. Of the 40 analysts, 80.00% are bullish and 20.00% recommend neutrality. There are no analysts who recommend being bearish.
According to Moomoo, the average target stock price presented by analysts is $157.23, which is about 13% lower than the current situation. Of the 40 analysts, 80.00% are bullish and 20.00% recommend neutrality. There are no analysts who recommend being bearish.
What are 2.5/3D chips? What is the impact on AI data centers?
2.5/3D chips are a new generation of semiconductor chips that exceed the limits of conventional flat chips. By integrating multiple chiplets and dies into one package, higher performance, lower power consumption, and space optimization are possible.
2.5/3D chips are a new generation of semiconductor chips that exceed the limits of conventional flat chips. By integrating multiple chiplets and dies into one package, higher performance, lower power consumption, and space optimization are possible.
AMD's new MI300X series, which went on sale on 2023/12/6, is an example of a 3D chip equipped with advanced memory technology such as HBM3, and provides a maximum total memory of 192 GB and a bandwidth of 5.6 TB/s, and has been greatly improved from the previous generation.
These 3D chips are ideal for AI data centers and HPC applications, and require high computational power, advanced memory, and high bandwidth to handle complex and demanding AI and model training workloads.
2.5/3D stacking technology is essential to meet the performance requirements and high demands of AI and data center applications. Driven by HPC applications, the market for these technologies is growing rapidly and is expected to reach $107.48 billion by 2033. This market is in need of 3D chip technology.
— MooMoo News Zeber
Sources: Bloomberg, IG, Investing, Moomoo, S&P Global, TipRanks, SeekingAlpha
This article uses automatic translation for some of its parts
Sources: Bloomberg, IG, Investing, Moomoo, S&P Global, TipRanks, SeekingAlpha
This article uses automatic translation for some of its parts
Disclaimer: Moomoo Technologies Inc. is providing this content for information and educational use only.
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