Following Apple, TSMC is also snatching customers from Samsung with the semiconductor packaging revolution.

9/3 (Tue) 8:41 distribution (excerpt)

TSMC, which holds 61% of the world's foundry (semiconductor outsourcing) market, and its core competitiveness lies in advanced packaging technology. The company's operating margin last year was 43%, despite producing almost no memory chips, it has big tech customers such as Apple, Nvidia, Google, and Microsoft.
The current TSMC was built on bold investments 15 years ago. TSMC's founder, Morris Chang, retired once and returned as CEO in 2009. According to the Taiwanese book 'TSMC, Light of the Semiconductor Island', it was at this time that they began investing in advanced packaging. CEO Chang accepted the proposal from Chiang Shang-yi, the former vice president of research and development, to nurture packaging, and persuaded one external director at a time to double the capital expenditure in 2010.