Production hurdles for the GB200 are raising rumors of reduced orders from Microsoft 🤔🤔

6:06 AM, Monday, December 2nd [News]

Production hurdles for the GB200 chip lead to rumors of Microsoft cutting orders.

As demand for artificial intelligence continues to surge, the industry's need for high-performance computing chips is increasing. According to a report from Commercial Times, NVIDIA's next-generation Blackwell architecture chip, the GB200, is facing new technological hurdles in its production plan. In response to this, CSP provider Microsoft is reportedly reducing orders. Industry sources quoted by Commercial Times state that the issue lies in the backplane connection design. The test yield of the cartridge connectors provided by Amphenole, a Tier 1 supplier in the USA, is less than optimal, potentially delaying mass production until March 2025. The GB200 chip adopts TSMC's cutting-edge CoWoS-L advanced packaging technology, incorporating a highly complex cabinet design. However, this complexity has led to various challenges such as chip design overheating, UQD leaks, and insufficient yield of copper cables. NVIDIA recently announced in its earnings report that Blackwell production has been fully initiated, but supply constraints remain a pressing issue, with the company working with partners to address it.