Kaga Toshiba's 300mm compatible power semiconductor manufacturing building completed and began full-scale operation in the second half of fiscal year 24

Toshiba Devices & Storage held a completion ceremony for a new 300mm wafer compatible power semiconductor manufacturing building (phase 1) at Kaga Toshiba Electronics on 2024/5/23. Full-scale operation is scheduled for the second half of fiscal 2024, and during full operation, the production capacity of power semiconductors is expected to increase 2.5 times compared to fiscal 2021.