Lantronix Announces Five New System-in-Package Solutions Powered by Qualcomm for AI/ML and Video Solutions at the Edge
IRVINE, Calif., Oct. 09, 2024 (GLOBE NEWSWIRE) -- Lantronix Inc. (NASDAQ: LTRX), a global leader of compute and connectivity IoT solutions, today announced its powerful new System-in-Package (SiP) solutions powered by Qualcomm® Technologies’ chipsets that reinforce Lantronix’s position in industrial and enterprise IoT innovation, bringing advanced Artificial Intelligence (AI) and Machine Learning (ML) capabilities to the edge.
Qualcomm Technologies and Lantronix have had strong relationships for more than 15 years,” stated Dev Singh, vice president of Business Development and head of Industrial Automation at Qualcomm Technologies Inc. “Utilizing Qualcomm Technologies’ cutting-edge processors, Lantronix enables its customers to seamlessly deploy AI solutions at the edge, bringing its expertise in embedded computing and IoT to deliver reliable, industrial-grade systems.”
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