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Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore. Jan. 08, 2025 (GLOBE NEWSWIRE)

$Micron Technology (MU.US)$ Approximate $7 billion investment over the next several years to meet AI data center demand. Mu broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore. Micron marked the occasion with a ceremony attended by Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Chairman of the Singapore Economic Development Board, Pee Beng Kong, Executive Vice President of the Singapore Economic Development Board, and Tan Boon Khai, CEO of JTC Corporation.
The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth. The launch of this facility will further strengthen Singapore’s local semiconductor ecosystem and innovation.
Micron’s HBM advanced packaging investment of approximately US $7 billion (SG$9.5 billion) through the end of the decade and beyond will initially create around 1,400 jobs, with site expansion plans to reach an estimated 3,000 jobs in the future. These new roles will include functions such as packaging development, assembly and test operations.
Conclusion; so, as I have been saying for 6 months now against all the analyst downgrades the HBM 3rd generation microchips are the future for data centers and LLM.
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