Micron Expands HBM Production in U.S. and Considers Malaysia

👉 Key Highlights:

📍 Micron aims to increase HBM market share to ~25% within a year.

📍 Expanding production capacity in Taiwan and R&D in the U.S.

📍 Considering HBM3E production in Malaysia.

📍 HBM DRAM dies are higher-capacity with a wider interface.

📍 Each HBM module stacks 8-12 HBM dies using through-silicon vias.

📍 Largest HBM production site in Taichung, Taiwan, adding capacity.

📍 HBM3E memory supply sold out through most of 2025.

📍 Malaysia may test and assemble HBM3E dies, but not produce DRAM dies.

📍 Additional test production lines set up in Boise, Idaho.

📍 Expanding U.S. R&D for next-gen HBM4 memory by 2025-2026.

👉 Context/Background:

Micron Technology, a leading memory chip manufacturer, is aggressively expanding its high bandwidth memory (HBM) production to capture a larger market share. HBM is crucial for advanced computing applications, offering higher capacity and faster speeds compared to traditional DRAM. Micron's strategic moves include boosting production in Taiwan, enhancing R&D in the U.S., and potentially expanding operations to Malaysia.

👉 Market Insights:

📍 Micron's efforts to ramp up HBM production position it to better compete with SK Hynix and Samsung.

📍 Ensuring a stable HBM supply is vital for partners like Nvidia, which rely on these advanced memory solutions.