Micron Expands HBM Production in U.S. and Considers Malaysia
![Micron Expands HBM Production in U.S. and Considers Malaysia](https://ussnsimg.moomoo.com/sns_client_feed/70042925/20240620/c6fd073777ed471a87c7b7b4949ac499.png/big?area=999&is_public=true)
👉 Key Highlights:
📍 Micron aims to increase HBM market share to ~25% within a year.
📍 Expanding production capacity in Taiwan and R&D in the U.S.
📍 Considering HBM3E production in Malaysia.
📍 HBM DRAM dies are higher-capacity with a wider interface.
📍 Each HBM module stacks 8-12 HBM dies using through-silicon vias.
📍 Largest HBM production site in Taichung, Taiwan, adding capacity.
📍 HBM3E memory supply sold out through most of 2025.
📍 Malaysia may test and assemble HBM3E dies, but not produce DRAM dies.
📍 Additional test production lines set up in Boise, Idaho.
📍 Expanding U.S. R&D for next-gen HBM4 memory by 2025-2026.
👉 Context/Background:
Micron Technology, a leading memory chip manufacturer, is aggressively expanding its high bandwidth memory (HBM) production to capture a larger market share. HBM is crucial for advanced computing applications, offering higher capacity and faster speeds compared to traditional DRAM. Micron's strategic moves include boosting production in Taiwan, enhancing R&D in the U.S., and potentially expanding operations to Malaysia.
👉 Market Insights:
📍 Micron's efforts to ramp up HBM production position it to better compete with SK Hynix and Samsung.
📍 Ensuring a stable HBM supply is vital for partners like Nvidia, which rely on these advanced memory solutions.
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Paul Anthony : very helpful and bigger than from the god give you the best with this tq God bless![pray 🙏](https://static.moomoo.com/nnq/emoji/static/image/img-apple-64/1f64f.png)
Amen