Micron introduces a new series of HBM3E memory chips (from Tweakers)

$Micron Technology (MU.US)$ $Micron Technology (MU.US)$ These consist of TWELVE layers instead of eight. This means they have a higher capacity of 36GB. The bandwidth is again 'more than 1.2TB/s'.
Micron confirms that the new HBM3E 12-high modules are being delivered to customers. Because the number of layers of the memory chips has been increased to twelve, the chips have a 50 % higher CAPACITY than their predecessors with eight layers. Previous HBM3E chips had a capacity of 24GB, but this is increased to 36GB with the new modules.
The American memory manufacturer also says that the bandwidth is more than 9.2 Gbit/s per pin. On an entire module, which consists of 1024 pins, this amounts to more than 1.2TB/s, the manufacturer says. The bandwidth therefore appears unchanged compared to the company's existing HBM3E 8-high modules.