Nvidia and AMD have reserved all of TSMC’s CoWoS and SoIC ad...

Nvidia and AMD have reserved all of TSMC’s CoWoS and SoIC advanced packaging capacity for 2024 and 2025 for HPC (high performance computing) related chips, media report, prompting TSMC to further expand capacity, with CoWoS seen at 45,000 to 50,000 wafers per month by the end of this year, from 15,000 at the end of 2023. $NVIDIA (NVDA.US)$ $Advanced Micro Devices (AMD.US)$ $Taiwan Semiconductor (TSM.US)$