NVIDIA’s Blackwell Overcomes Delays, as GB200 Reportedly Sets for December Mass Production
According to a report from Commercial Times citing sources, it’s revealed that NVIDIA has executed changes to the Blackwell series’ 6-layer GPU mask. Therefore, the process can now proceed without re-taping out, as production delays being minimized.
The report noted that NVIDIA’s updated version of B200 is expected to be completed by late October, allowing the GB200 to enter mass production in December, with large-scale deliveries to ODMs expected in the first quarter of next year.
Previously, as per a report from The Information, NVIDIA’s GB200 was said to be experiencing a one-quarter delay in mass shipments. Another report from the Economic Daily News further suggested that the problem likely lies in the yield rates of advanced packaging, which mainly affected the non-reference-designed GB200 chips.
Industry sources cited by Commercial Times addressed that NVIDIA’s Blackwell chip used to be facing instability in metal layers during the HV process, which was then resolved by July.
In addition, since the issue reportedly occurred in the back-end-of-line process, a new tape-out was deemed unnecessary. Still, as CoWoS-L capacity remains a bottleneck, the advanced packaging for GB200 this year is expected to adopt CoWoS-S.
The report noted that NVIDIA’s updated version of B200 is expected to be completed by late October, allowing the GB200 to enter mass production in December, with large-scale deliveries to ODMs expected in the first quarter of next year.
Previously, as per a report from The Information, NVIDIA’s GB200 was said to be experiencing a one-quarter delay in mass shipments. Another report from the Economic Daily News further suggested that the problem likely lies in the yield rates of advanced packaging, which mainly affected the non-reference-designed GB200 chips.
Industry sources cited by Commercial Times addressed that NVIDIA’s Blackwell chip used to be facing instability in metal layers during the HV process, which was then resolved by July.
In addition, since the issue reportedly occurred in the back-end-of-line process, a new tape-out was deemed unnecessary. Still, as CoWoS-L capacity remains a bottleneck, the advanced packaging for GB200 this year is expected to adopt CoWoS-S.
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A Mechanical Engineer/Funded Trader who loves investment and analysis
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LittleSoldier : Suspecting soon the shorts
will be MIA around that time!! Just Big Fat Bulls 
!!!