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Micron Technology
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Roadmap Update
The latest information on GB300 and GB200.
GB300: Scheduled for release in the second half of next year. It will be followed by VR200.
GB200: The biggest challenge is the shortage of Amphenol connectors. Limited supply is expected next year. Although the supply for 4k racks in 1Q 2025 and 6k racks in 2Q was planned, it is difficult to achieve the annual target of 50k racks due to the very high demand for GB200. NV Corporation is considering resuming the production of B200 and reallocating some production capacity to GB200.
GB300 is an improved version of GB200:
HBM is upgraded from 8Hi to 12Hi, and the memory capacity is increased from 192GB to 288GB.
Upgrade CX switch from CX7 to CX8.
By adopting socket design, it is possible to sell the GPU separately and avoid monopoly issues.
Using bianca for the motherboard, integrating GPU, CPU, and CX7.
Also planning to provide large motherboards as reference designs.
The CPU can be changed to Intel, and the CX7 to Astera Labs or AVGO.
GB300 Computing Tray:
Changing the quick connectors to NVQD.
Previously using 4 UQDs with 2 bianca modules, but now increasing to 12. The increased use of QDs makes miniaturization more difficult.
Using BBU and Supercapacitors for power supply. Supercapacitors are recommended as standard equipment. Using 4 trays per rack, MSFT and Oracle do not plan to use BBU. AWS, Google, Meta, etc. are expected to use BBU.
* Content Value: The content of the 140kW rack power supply unit is about $14,000. Supercapacitors cost between $3,000 and $3,500 per Shell PLC ADR, using four of them. An additional $1,000 for the BBU. The BBU may use 3kW, 5kW, or 8kW depending on the design.
* Supercapacitors: Developed by Musashi of Japan to handle short-duration high current discharges, using extremely high-density EDLC. The only product of its kind in the world.
* NVL Supplier List: The number of suppliers is increasing, leading to more complex trades.
* Power Shell Suppliers: Delta, Liteon, and Flex are the three main suppliers.
Additional Explanation
* HBM: Short for High Bandwidth Memory, referring to high-bandwidth memory.
* CX Switch: Short for Connectivity Switch, referring to the chip controlling network connections.
* BBU: Abbreviation of Battery Backup Unit, referring to the backup power supply unit.
* EDLC: Short for Electric Double-Layer Capacitor, referring to an Electric Double-Layer Capacitor. A type of Supercapacitors.
GB300: Scheduled for release in the second half of next year. It will be followed by VR200.
GB200: The biggest challenge is the shortage of Amphenol connectors. Limited supply is expected next year. Although the supply for 4k racks in 1Q 2025 and 6k racks in 2Q was planned, it is difficult to achieve the annual target of 50k racks due to the very high demand for GB200. NV Corporation is considering resuming the production of B200 and reallocating some production capacity to GB200.
GB300 is an improved version of GB200:
HBM is upgraded from 8Hi to 12Hi, and the memory capacity is increased from 192GB to 288GB.
Upgrade CX switch from CX7 to CX8.
By adopting socket design, it is possible to sell the GPU separately and avoid monopoly issues.
Using bianca for the motherboard, integrating GPU, CPU, and CX7.
Also planning to provide large motherboards as reference designs.
The CPU can be changed to Intel, and the CX7 to Astera Labs or AVGO.
GB300 Computing Tray:
Changing the quick connectors to NVQD.
Previously using 4 UQDs with 2 bianca modules, but now increasing to 12. The increased use of QDs makes miniaturization more difficult.
Using BBU and Supercapacitors for power supply. Supercapacitors are recommended as standard equipment. Using 4 trays per rack, MSFT and Oracle do not plan to use BBU. AWS, Google, Meta, etc. are expected to use BBU.
* Content Value: The content of the 140kW rack power supply unit is about $14,000. Supercapacitors cost between $3,000 and $3,500 per Shell PLC ADR, using four of them. An additional $1,000 for the BBU. The BBU may use 3kW, 5kW, or 8kW depending on the design.
* Supercapacitors: Developed by Musashi of Japan to handle short-duration high current discharges, using extremely high-density EDLC. The only product of its kind in the world.
* NVL Supplier List: The number of suppliers is increasing, leading to more complex trades.
* Power Shell Suppliers: Delta, Liteon, and Flex are the three main suppliers.
Additional Explanation
* HBM: Short for High Bandwidth Memory, referring to high-bandwidth memory.
* CX Switch: Short for Connectivity Switch, referring to the chip controlling network connections.
* BBU: Abbreviation of Battery Backup Unit, referring to the backup power supply unit.
* EDLC: Short for Electric Double-Layer Capacitor, referring to an Electric Double-Layer Capacitor. A type of Supercapacitors.
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