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Schneider Electric and NVIDIA have announced the design of an AI datacenter cooling system.
Schneider Electric (OTCPK:SBGSF) is collaborating with the AI giant Nvidia (NASDAQ: NVDA) on the design of new AI datacenter cooling and infrastructure.
Both companies have announced a jointly developed datacenter reference design. This design supports liquid-cooled high-density AI clusters of up to 132kW per server rack. This design is from Nvidia ( NVDA Used for GB200 NVL72 and Blackwell chips.
Designs can be customized for cloud computing and datacenter customers. Financial details regarding the partnership are confidential.
Schneider Electric has also released a new scalable 1.25 MW modular UPS Galaxy VXL for AI, data centers, and large-scale electricity workloads.Has been released.
Both companies have announced a jointly developed datacenter reference design. This design supports liquid-cooled high-density AI clusters of up to 132kW per server rack. This design is from Nvidia ( NVDA Used for GB200 NVL72 and Blackwell chips.
Designs can be customized for cloud computing and datacenter customers. Financial details regarding the partnership are confidential.
Schneider Electric has also released a new scalable 1.25 MW modular UPS Galaxy VXL for AI, data centers, and large-scale electricity workloads.Has been released.
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