Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip DesignSeptember 25, 2024

$Synopsys (SNPS.US)$ SUNNYVALE, PRNewswire/ Today announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs. The relentless computational demands in AI applications require semiconductor technologies to keep pace. From an industry leading AI-driven EDA suite, powered by Synopsys.ai™ for enhanced productivity and silicon results to complete solutions that facilitate the migration to 2.5/3D multi-die architectures, Synopsys and TSMC have worked closely for decades to pave the path for the future of billion to trillion-transistor AI chip designs. Good Job