Taiwanese semiconductor and Nvidia are in negotiations to manufacture AI chips at the Arizona factory - Report.
Reuters reported, citing sources familiar with the matter, that Taiwan Semiconductor Manufacturing (NYSE: TSM）が、アリゾナ州にある台湾企業の新工場でブラックウェルAIチップを生産するため、エヌビディア（NASDAQ: NVDA）と交渉中であると報じた。
TSMはすでに来年初めに製造を開始する準備を進めていると報道は付け加えた。
NvidiaのBlackwellチップは3月に発表され、これまで台湾のTSMCの施設で製造されてきた。Nvidiaは、生成AIやアクセラレーテッドコンピューティングに携わる顧客からこのチップに対する高い需要を目にしている。
Reports indicate that if this agreement is realized, a new customer will be secured for TSM's Arizona factory, scheduled to start mass production in 2025.
According to reports, the current customers of the Arizona factory are Apple (AAPL) and Advanced Micro Devices (AMD ).
TSM plans to conduct the front-end process of NVIDIA's Blackwell chips in Arizona, but the processors will need to be sent back to Taiwan for encapsulation. The Arizona factory reportedly lacks the production capacity for CoWoS (Chip on Wafer on Substrate) required for Blackwell chips.
According to reports, TSM's CoWoS capability is currently all located in Taiwan.
The Biden administration reached an incentive agreement on chip legislation with TSM last month.Make the final decisionIt was pointed out that this contract will stimulate $65 billion in private investment to build three facilities in Arizona, creating tens of thousands of jobs by the end of the decade.
TSMはすでに来年初めに製造を開始する準備を進めていると報道は付け加えた。
NvidiaのBlackwellチップは3月に発表され、これまで台湾のTSMCの施設で製造されてきた。Nvidiaは、生成AIやアクセラレーテッドコンピューティングに携わる顧客からこのチップに対する高い需要を目にしている。
Reports indicate that if this agreement is realized, a new customer will be secured for TSM's Arizona factory, scheduled to start mass production in 2025.
According to reports, the current customers of the Arizona factory are Apple (AAPL) and Advanced Micro Devices (AMD ).
TSM plans to conduct the front-end process of NVIDIA's Blackwell chips in Arizona, but the processors will need to be sent back to Taiwan for encapsulation. The Arizona factory reportedly lacks the production capacity for CoWoS (Chip on Wafer on Substrate) required for Blackwell chips.
According to reports, TSM's CoWoS capability is currently all located in Taiwan.
The Biden administration reached an incentive agreement on chip legislation with TSM last month.Make the final decisionIt was pointed out that this contract will stimulate $65 billion in private investment to build three facilities in Arizona, creating tens of thousands of jobs by the end of the decade.
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