Taiwanese company, Taiwan Semiconductor, secures a $7.5 billion capital increase for business expansion in Arizona, aiming to enhance chip production.

2024/09/25 00:07

On Monday, Taiwan Semiconductor Manufacturing Company (NYSE: TSM) has obtained government approval for an additional $7.5 billion investment into the Arizona branch of Taiwan Semiconductor, cited Taipei Times quoting the Investment Commission's statement.
This capital injection follows the $5 billion investment approved for Taiwan Semiconductor in Arizona in June.
Recently, the contract chip maker denied reports claiming that their new foreign investment plan is backed by subsidies from the United Arab Emirates (UAE).

According to recent reports, Taiwan Semiconductor continues to focus on ambitions in the United States, attracting smart phone chip trades from Alphabet Inc. (NASDAQ: GOOG) (NASDAQ: GOOGL), Google, and Apple Inc. (NASDAQ: AAPL).
Taiwan Semiconductor's first Arizona fab is set to begin mass production in the first half of next year using 4nm process technology, with the second fab planned to start using 3nm and 2nm process technology in 2028.
Taiwan Semiconductor is considering a total investment in Arizona exceeding 65 billion dollars, planning for a third fab using processes of 2nm or smaller.
Furthermore, the same chip maker is launching a fab in Kumamoto, Japan in February, planning for a second fab involving a 20 billion dollar investment.
In Europe, construction began on a 12-inch wafer fab in Dresden, Germany in August.