Taiwan Semiconductor to Hike 3nm Chip Prices by Over 5% in 2024

👉 Key Highlights:

📍 TSM plans to increase 3nm chip prices by over 5%.

📍 Advanced packaging prices to rise by 10-20% in 2024.

📍 N3P mass production set for the second half of 2024.

📍 N3X and N3A targeted for high-performance computing and automotive clients.

📍 Zhunan advanced packaging plant (AP6) doubles capacity to 33,000 wafers monthly.

📍 Nvidia occupies about half of TSM’s advanced packaging capacity.

📍 Demand for 3nm chips to drive near full capacity utilization through 2025.

📍 5nm process also experiencing strong demand due to AI needs.

👉 Market Insights:

📍 TSMC's pricing strategy may influence the broader semiconductor market and pricing trends.

📍 Companies reliant on TSMC for advanced packaging may face increased costs, impacting their financials and market strategies.

👉 Expert Statement:

🗨️ "Previously, NVIDIA CEO Jensen Huang emphasized that TSMC is not just manufacturing wafers but also handling numerous supply chain issues. He also agreed that the current pricing is too low and would support TSMC’s price increase actions."