$Taiwan Semiconductor (TSM.US)$ The USA is paying attention ...

In fact, chips can be disassembled and then commissioned to IP companies or IC design companies for separate high-end wafer foundry production under the names of ASIC such as NPU, CPU, GPU, FPGA, HBM 2, 3, etc.

These ASIC wafers are then packaged into an AI chip with advanced encapsulation...