TSMC's latest technology to accelerate technological innovation through AI

Published 2024/07/03 at 10:30 (some excerpts)

TSMC held a technical briefing session for technology-specialized media to coincide with the technical presentation “TSMC Technology Symposium” for customers held in Yokohama. At the briefing session, an overview of the semiconductor manufacturing process “TSMC A16” technology and “TSMC System-on-Wafer (TSMC-SOW)” etc. to accelerate AI innovation was introduced.