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Rather than excluding China, the only way to survive is to sell to China at the lowest price in the world. At this rate, I will lose to HUAWEI's GPU next year.

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As a result, there are suppliers experiencing a decrease in orders.
To avoid being misled by uncertain information.
On the 16th, Jensen Huang, CEO of the leading U.S. semiconductor company NVIDIA, mentioned that the demand for advanced packaging by Taiwan Semiconductor Manufacturing Company (TSMC) is strong, but the type of technology required is changing.
Their cutting-edge Artificial Intelligence (AI) chip 'Blackwell' is composed of multiple chips bonded using the advanced packaging technology 'CoWoS' provided by TSMC.
The CEO explained at the event held in Taichung City that with the transition to the next-generation AI semiconductor "Blackwell", they plan to mainly use CoWoS-L.
They are continuing to manufacture the current product "Hopper", which uses CoWoS-S, and stated that the production capacity of CoWoS-S will also transition to CoWoS-L.
"It means transitioning the production capacity of CoWoS-S to CoWoS-L, and expanding the capacity of CoWoS-L," he said.
The company has mainly...