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Taiwan Semiconductor | 6-K: Report of foreign private issuer (related to financial reporting)

Taiwan Semiconductor | 6-K: Report of foreign private issuer (related to financial reporting)

台积电 | 6-K：外国发行人报告（业绩相关）
美股SEC公告 ·  02/07 06:05

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Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on both TWSE and NYSE under the ticker TSM, has reported a significant increase in its January 2024 consolidated net revenue. The revenue reached approximately NT$215.79 billion, marking a 22.4% rise from December 2023 and a 7.9% increase compared to January 2023. The report, filed with the United States Securities and Exchange Commission on February 7, 2024, also detailed the company's financial activities including loans to subsidiaries, endorsements, guarantees, and financial derivative transactions. TSMC's lending to its subsidiaries included an outstanding amount of NT$38.34 billion to TSMC China. Guarantees provided to various TSMC subsidiaries totaled NT$2.60 billion for TSMC Global, NT$234.60 billion for TSMC Arizona, and NT$251.25 billion for TSMC Design Technology Japan, among others. The company's financial derivatives, both those applying and not applying hedge accounting, were also disclosed, with outstanding notional amounts and unrealized profit/loss figures provided for each category.
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on both TWSE and NYSE under the ticker TSM, has reported a significant increase in its January 2024 consolidated net revenue. The revenue reached approximately NT$215.79 billion, marking a 22.4% rise from December 2023 and a 7.9% increase compared to January 2023. The report, filed with the United States Securities and Exchange Commission on February 7, 2024, also detailed the company's financial activities including loans to subsidiaries, endorsements, guarantees, and financial derivative transactions. TSMC's lending to its subsidiaries included an outstanding amount of NT$38.34 billion to TSMC China. Guarantees provided to various TSMC subsidiaries totaled NT$2.60 billion for TSMC Global, NT$234.60 billion for TSMC Arizona, and NT$251.25 billion for TSMC Design Technology Japan, among others. The company's financial derivatives, both those applying and not applying hedge accounting, were also disclosed, with outstanding notional amounts and unrealized profit/loss figures provided for each category.
台湾半导体制造股份有限公司（TSMC）在台交所和纽约证券交易所上市，股票代码为TSM，该公司报告其2024年1月的合并净收入大幅增长。收入达到约新台币2157.9亿元，较2023年12月增长22.4％，与2023年1月相比增长7.9％。该报告于2024年2月7日向美国证券交易委员会提交，还详细介绍了该公司的财务活动，包括对子公司的贷款、背书、担保和金融衍生品交易。台积电向其子公司提供的贷款包括向台积电中国提供的383.4亿新台币的未偿贷款。向台积电各子公司提供的担保总额为台积电全球26亿新台币，亚利桑那州台积电的担保总额为2346.0亿新台币，日本台积电设计技术公司等的担保总额为2,512.5亿新台币。还披露了该公司的金融衍生品，包括适用和不适用套期保值会计的衍生品，并提供了每个类别的未清名义金额和未实现的损益数字。
台湾半导体制造股份有限公司（TSMC）在台交所和纽约证券交易所上市，股票代码为TSM，该公司报告其2024年1月的合并净收入大幅增长。收入达到约新台币2157.9亿元，较2023年12月增长22.4％，与2023年1月相比增长7.9％。该报告于2024年2月7日向美国证券交易委员会提交，还详细介绍了该公司的财务活动，包括对子公司的贷款、背书、担保和金融衍生品交易。台积电向其子公司提供的贷款包括向台积电中国提供的383.4亿新台币的未偿贷款。向台积电各子公司提供的担保总额为台积电全球26亿新台币，亚利桑那州台积电的担保总额为2346.0亿新台币，日本台积电设计技术公司等的担保总额为2,512.5亿新台币。还披露了该公司的金融衍生品，包括适用和不适用套期保值会计的衍生品，并提供了每个类别的未清名义金额和未实现的损益数字。
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