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6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

6-K:外国发行人报告
美股sec公告 ·  05/10 06:08
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On May 10, 2024, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), a global leader in semiconductor foundry services, conducted a special Board of Directors meeting. During this meeting, the Board approved the company's first quarter Business Report and Financial Statements for 2024. TSMC reported a consolidated revenue of NT$592.64 billion and a net income of NT$225.49 billion, resulting in diluted earnings per share of NT$8.70. Additionally, the Board approved a cash dividend of NT$4.00 per share for the first quarter of 2024. The record date for common stock shareholders eligible for the dividend is set for September 18, 2024, with the ex-dividend date on September 12, 2024. The dividend is scheduled to be paid on October 9, 2024. The same ex-dividend date applies to TSMC American Depositary Shares...Show More
On May 10, 2024, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), a global leader in semiconductor foundry services, conducted a special Board of Directors meeting. During this meeting, the Board approved the company's first quarter Business Report and Financial Statements for 2024. TSMC reported a consolidated revenue of NT$592.64 billion and a net income of NT$225.49 billion, resulting in diluted earnings per share of NT$8.70. Additionally, the Board approved a cash dividend of NT$4.00 per share for the first quarter of 2024. The record date for common stock shareholders eligible for the dividend is set for September 18, 2024, with the ex-dividend date on September 12, 2024. The dividend is scheduled to be paid on October 9, 2024. The same ex-dividend date applies to TSMC American Depositary Shares (ADSs), with the record date also falling on September 12, 2024, coinciding with the New York Stock Exchange's transition to a shortened securities settlement cycle from two business days to one business day starting May 28, 2024. TSMC, established in 1987, has maintained its position as the world's leading dedicated semiconductor foundry. The company supports a vast ecosystem of customers and partners with advanced process technologies and design solutions, contributing to the semiconductor industry's innovation. In 2023, TSMC utilized 288 distinct process technologies and manufactured 11,895 products for 528 customers, offering a wide range of advanced and specialty packaging technology services.
2024 年 5 月 10 日,全球领先的半导体代工服务公司台湾半导体制造股份有限公司(TSMC)举行了一次特别的董事会会议。在这次会议上,董事会批准了公司2024年第一季度业务报告和财务报表。台积电公布的合并收入为新台币5926.4亿元,净收益为新台币2254.9亿元,摊薄后的每股收益为新台币8.70元。此外,董事会批准了2024年第一季度每股4.00新台币的现金分红。有资格获得分红的普通股股东的记录日期定为2024年9月18日,除息日为2024年9月12日。股息计划于2024年10月9日支付。同样的除息日适用于台积电美国存托股票(ADS),创纪录的日期也为2024年9月12日,恰逢纽约证券...展开全部
2024 年 5 月 10 日,全球领先的半导体代工服务公司台湾半导体制造股份有限公司(TSMC)举行了一次特别的董事会会议。在这次会议上,董事会批准了公司2024年第一季度业务报告和财务报表。台积电公布的合并收入为新台币5926.4亿元,净收益为新台币2254.9亿元,摊薄后的每股收益为新台币8.70元。此外,董事会批准了2024年第一季度每股4.00新台币的现金分红。有资格获得分红的普通股股东的记录日期定为2024年9月18日,除息日为2024年9月12日。股息计划于2024年10月9日支付。同样的除息日适用于台积电美国存托股票(ADS),创纪录的日期也为2024年9月12日,恰逢纽约证券交易所从2024年5月28日起将证券结算周期从两个工作日缩短为一个工作日。台积电成立于1987年,一直保持其作为全球领先的专用半导体代工企业的地位。该公司通过先进的工艺技术和设计解决方案为庞大的客户和合作伙伴生态系统提供支持,为半导体行业的创新做出了贡献。2023 年,台积电使用了 288 种不同的工艺技术,为 528 个客户生产了 11,895 种产品,提供广泛的先进和特种封装技术服务。
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