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Qualcomm | 8-K: Entry into a Credit Agreement

Qualcomm | 8-K: Entry into a Credit Agreement

高通 | 8-K：签订信贷协议
美股sec公告 ·  08/09 16:08
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On August 8, 2024, Qualcomm Incorporated entered into a new Credit Agreement with Bank of America, N.A., serving as the administrative agent, swing line lender, and a letter of credit issuer. This agreement replaces Qualcomm's previous Credit Agreement from December 8, 2020. The new Credit Agreement provides Qualcomm with $4.0 billion in senior unsecured revolving loans, maturing on August 8, 2029, with the option to extend. The funds may be used for general corporate purposes, including working capital and capital expenditures. The agreement allows borrowing in various currencies and includes interest rates based on the Term SOFR Rate plus a margin or the Base Rate plus a margin, along with a facility fee. The terms also include customary representations, warranties, covenants, and events of default, with specific requirements on the Company's debt ratios. Concurrently, Qualcomm terminated all commitments under the previous Credit Agreement, which had no outstanding borrowings at the time of termination.
On August 8, 2024, Qualcomm Incorporated entered into a new Credit Agreement with Bank of America, N.A., serving as the administrative agent, swing line lender, and a letter of credit issuer. This agreement replaces Qualcomm's previous Credit Agreement from December 8, 2020. The new Credit Agreement provides Qualcomm with $4.0 billion in senior unsecured revolving loans, maturing on August 8, 2029, with the option to extend. The funds may be used for general corporate purposes, including working capital and capital expenditures. The agreement allows borrowing in various currencies and includes interest rates based on the Term SOFR Rate plus a margin or the Base Rate plus a margin, along with a facility fee. The terms also include customary representations, warranties, covenants, and events of default, with specific requirements on the Company's debt ratios. Concurrently, Qualcomm terminated all commitments under the previous Credit Agreement, which had no outstanding borrowings at the time of termination.
2024年8月8日，高通公司与美国银行有限责任公司签署了一份新的授信协议，美国银行有限责任公司担任行政代理、摇摆额度贷款人和信用证发行人。该协议取代了高通公司2020年12月8日的先前授信协议。新的授信协议为高通公司提供了40亿美元的无担保高级循环贷款，在2029年8月8日到期，有续约选项。这笔资金可以用于一般企业用途，包括营运资本和资本支出。该协议允许以各种货币借款，并包括基于期限SOFR利率加边际或基准利率加边际以及设施费用等利率。条款还包括习惯的陈述、保证、契约和违约事件，并具有公司债务比率的具体要求。同时，高通公司终止了先前授信协议下的所有承诺，在终止时未有未偿还款项。
2024年8月8日，高通公司与美国银行有限责任公司签署了一份新的授信协议，美国银行有限责任公司担任行政代理、摇摆额度贷款人和信用证发行人。该协议取代了高通公司2020年12月8日的先前授信协议。新的授信协议为高通公司提供了40亿美元的无担保高级循环贷款，在2029年8月8日到期，有续约选项。这笔资金可以用于一般企业用途，包括营运资本和资本支出。该协议允许以各种货币借款，并包括基于期限SOFR利率加边际或基准利率加边际以及设施费用等利率。条款还包括习惯的陈述、保证、契约和违约事件，并具有公司债务比率的具体要求。同时，高通公司终止了先前授信协议下的所有承诺，在终止时未有未偿还款项。
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