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6-K: ESMC Breaks Ground on Dresden Fab

6-K: ESMC Breaks Ground on Dresden Fab

6-K:ESMC德累斯顿工厂破土动工
美股SEC公告 ·  08/20 09:23

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On August 20, 2024, a groundbreaking ceremony was held in Dresden, Germany, for the first semiconductor fabrication plant of the European Semiconductor Manufacturing Company (ESMC), a joint venture between Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. The event was attended by high-profile European leaders, including European Commission President Ursula von der Leyen and German Chancellor Olaf Scholz. The EU Commission has approved a €5 billion German measure to support the construction and operation of the fab under EU State aid rules. The Dresden facility, which is expected to start construction later in the year, will focus on meeting the semiconductor needs of the European automotive and industrial sectors. It will have a...Show More
On August 20, 2024, a groundbreaking ceremony was held in Dresden, Germany, for the first semiconductor fabrication plant of the European Semiconductor Manufacturing Company (ESMC), a joint venture between Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. The event was attended by high-profile European leaders, including European Commission President Ursula von der Leyen and German Chancellor Olaf Scholz. The EU Commission has approved a €5 billion German measure to support the construction and operation of the fab under EU State aid rules. The Dresden facility, which is expected to start construction later in the year, will focus on meeting the semiconductor needs of the European automotive and industrial sectors. It will have a monthly production capacity of 40,000 300mm wafers using TSMC's 28/22nm and 16/12nm process technologies. The total investment will exceed 10 billion euros, with contributions from equity, debt, and support from the EU and German government. The fab is expected to create around 2,000 direct high-tech jobs and stimulate additional indirect jobs throughout the EU supply chain. ESMC is committed to sustainability and environmental protection, aiming for LEED certification and implementing energy-efficient construction and water reclamation. The establishment of ESMC is a testament to TSMC's Grand Alliance and its commitment to fostering innovation in Europe.
2024年8月20日,欧洲半导体制造公司(ESMC)在德国德累斯顿举行了第一家半导体制造工厂的奠基仪式,该公司是台积电、罗伯特·博世有限公司、英飞凌科技公司和恩智浦半导体公司的联合创业企业。此次活动吸引了欧洲高级领导人的参与,包括欧盟委员会主席乌尔苏拉·冯·德莱恩和德国总理奥拉夫·肖尔茨。欧盟委员会已经批准了一项50亿欧元的德国措施,根据欧盟国家援助规则支持该工厂的建设和运营。德累斯顿工厂预计将于今年晚些时候开始施工,专注于满足欧洲汽车和工业部门的半导体需求。该工厂将使用台积电的28/22纳米和16/12纳米工艺技术,月产能为40,000个300毫米晶圆。总投资将超过100亿欧元,其中包括股权...展开全部
2024年8月20日,欧洲半导体制造公司(ESMC)在德国德累斯顿举行了第一家半导体制造工厂的奠基仪式,该公司是台积电、罗伯特·博世有限公司、英飞凌科技公司和恩智浦半导体公司的联合创业企业。此次活动吸引了欧洲高级领导人的参与,包括欧盟委员会主席乌尔苏拉·冯·德莱恩和德国总理奥拉夫·肖尔茨。欧盟委员会已经批准了一项50亿欧元的德国措施,根据欧盟国家援助规则支持该工厂的建设和运营。德累斯顿工厂预计将于今年晚些时候开始施工,专注于满足欧洲汽车和工业部门的半导体需求。该工厂将使用台积电的28/22纳米和16/12纳米工艺技术,月产能为40,000个300毫米晶圆。总投资将超过100亿欧元,其中包括股权、债务和欧盟及德国政府的支持。该工厂预计将创造大约2,000个直接的高科技就业机会,并刺激欧盟供应链的额外间接就业机会。ESMC致力于可持续发展和环境保护,力争获得LEED认证,实施节能施工和水资源回收。ESMC的成立是台积电大同盟计划和其在欧洲促进创新的承诺的证明。
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