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6-K: Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

6-K: Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

6-K：Amkor与台积电扩大合作伙伴关系并在亚利桑那州开展先进封装合作
美股SEC公告 ·  10/03 17:21

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Amkor Technology, Inc. and Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) have announced a memorandum of understanding to expand their partnership by collaborating on advanced packaging and test capabilities in Arizona. This collaboration aims to enhance the semiconductor ecosystem in the region and will involve Amkor providing turnkey advanced packaging and test services from their planned facility in Peoria, Arizona. TSMC will utilize these services to support its customers, especially those using TSMC's advanced wafer fabrication facilities in Phoenix. The agreement will accelerate product cycle times due to the proximity of TSMC's front-end fab and Amkor's back-end facility. The companies will jointly define specific packaging technologies to meet customer needs, emphasizing geographic flexibility and the development of a comprehensive semiconductor manufacturing ecosystem in the United States. The partnership is seen as a strategic move to drive innovation, advance semiconductor technology, and ensure resilient supply chains. Both companies have a history of collaboration and are committed to providing seamless technology alignment for customers globally.
Amkor Technology, Inc. and Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) have announced a memorandum of understanding to expand their partnership by collaborating on advanced packaging and test capabilities in Arizona. This collaboration aims to enhance the semiconductor ecosystem in the region and will involve Amkor providing turnkey advanced packaging and test services from their planned facility in Peoria, Arizona. TSMC will utilize these services to support its customers, especially those using TSMC's advanced wafer fabrication facilities in Phoenix. The agreement will accelerate product cycle times due to the proximity of TSMC's front-end fab and Amkor's back-end facility. The companies will jointly define specific packaging technologies to meet customer needs, emphasizing geographic flexibility and the development of a comprehensive semiconductor manufacturing ecosystem in the United States. The partnership is seen as a strategic move to drive innovation, advance semiconductor technology, and ensure resilient supply chains. Both companies have a history of collaboration and are committed to providing seamless technology alignment for customers globally.
Amkor Technology, Inc.和台积电制造股份有限公司（TSMC）已宣布签署谅解备忘录，以扩大合作伙伴关系，在亚利桑那州就爱文思控股和测试能力展开合作。该合作旨在增强该地区的半导体生态系统，并将涉及爱文思控股在亚利桑那州皮奥利亚计划设施提供一揽子爱文思控股高级封装和测试服务。台积电将利用这些服务来支持其客户，尤其是那些使用台积电在凤凰城的先进硅片制造设施的客户。由于台积电前端晶圆厂和爱文思控股后端设施之间的近距离，该协议将加快产品周期时间。双方公司将共同定义满足客户需求的特定封装技术，强调地理灵活性和在美国发展综合半导体制造生态系统。这一合作被视为推动创新、推进半导体技术并确保弹性供应链的战略举措。两家公司历史上有合作经验，致力于为全球客户提供无缝的科技对齐。
Amkor Technology, Inc.和台积电制造股份有限公司（TSMC）已宣布签署谅解备忘录，以扩大合作伙伴关系，在亚利桑那州就爱文思控股和测试能力展开合作。该合作旨在增强该地区的半导体生态系统，并将涉及爱文思控股在亚利桑那州皮奥利亚计划设施提供一揽子爱文思控股高级封装和测试服务。台积电将利用这些服务来支持其客户，尤其是那些使用台积电在凤凰城的先进硅片制造设施的客户。由于台积电前端晶圆厂和爱文思控股后端设施之间的近距离，该协议将加快产品周期时间。双方公司将共同定义满足客户需求的特定封装技术，强调地理灵活性和在美国发展综合半导体制造生态系统。这一合作被视为推动创新、推进半导体技术并确保弹性供应链的战略举措。两家公司历史上有合作经验，致力于为全球客户提供无缝的科技对齐。
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