Intel and Cadence Expand Partnership to Enable Best-in-Class SoC Design on Intel's Advanced Processes
Intel and Cadence Expand Partnership to Enable Best-in-Class SoC Design on Intel's Advanced Processes
Highlights:
亮点：
- Multiyear agreement to enable best-in-class system-on-chips (SoCs) for the AI, high performance computing (HPC) and mobile markets.
- Joint development on customized intellectual property (IP), design flows and design techniques for Intel's most advanced RibbonFET processes on Intel 18A and beyond.
- Further strengthening of strong existing partnership to advance Intel's IDM 2.0 strategy, creating a more robust offering for new and existing Intel Foundry Services (IFS) customers.
- 为期多年的协议，旨在为人工智能、高性能计算 (HPC) 和移动市场提供一流的片上系统 (SoC)。
- 在英特尔 18A 及更高版本上联合开发英特尔最先进的 RibbonFET 工艺的定制知识产权 (IP)、设计流程和设计技术。
- 进一步加强现有的强大合作伙伴关系，推进英特尔的 IDM 2.0 战略，为新的和现有的英特尔代工服务 (IFS) 客户创造更强大的产品。
SANTA CLARA, Calif. & SAN JOSE, Calif.— Intel Foundry Services (IFS) and Cadence Design Systems, Inc. (Nasdaq: CDNS) announced they have expanded their partnership and entered into a multiyear strategic agreement to jointly develop a portfolio of key customized IP, optimized design flows and techniques for Intel 18A technology featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery. Joint customers will be able to accelerate their SoC project schedules on process nodes from Intel 18A and beyond while optimizing for performance, power, area, bandwidth and latency for demanding AI, HPC and premium mobile applications.
加利福尼亚州圣克拉拉和加州圣何塞 — 英特尔代工服务 (IFS) 和Cadence Design Systems, Inc.（纳斯达克股票代码：CDNS）宣布，他们扩大了合作伙伴关系，并签订了一项为期多年的战略协议，共同开发一系列关键的定制IP、优化的设计流程和技术组合，这些技术采用RibbonFET栅极全能晶体管和PowerVia背面供电。共同客户将能够在英特尔 18A 及更高版本的流程节点上加快其 SoC 项目进度，同时针对要求苛刻的人工智能、高性能计算和高级移动应用程序优化性能、功耗、面积、带宽和延迟。
"We furthered our partnership with Intel Foundry Services through a significant strategic multiyear agreement to provide design software and leading IP at multiple Intel advanced nodes, thereby advancing Intel's IDM 2.0 strategy and accelerating mutual customer success," said Anirudh Devgan, president and chief executive officer at Cadence.
Cadence总裁兼首席执行官Anirudh Devgan表示：“我们通过一项为期多年的重要战略协议，进一步加强了与英特尔代工服务的合作伙伴关系，该协议旨在为多个英特尔高级节点提供设计软件和领先的IP，从而推进英特尔的IDM 2.0战略，加速共同客户的成功。”
"We're very excited to expand our partnership with Cadence to grow the IP ecosystem for IFS and provide choice for customers," said Stuart Pann, Intel senior vice president and general manager of IFS. "We will leverage Cadence's world-class portfolio of leading IP and advanced design solutions to enable our customers to deliver high-volume, high-performance and power-efficient SoCs on Intel's leading-edge process technologies."
英特尔高级副总裁兼IFS总经理斯图尔特·潘恩表示：“我们很高兴能够扩大与Cadence的合作伙伴关系，以发展IFS的知识产权生态系统，为客户提供选择。“我们将利用Cadence世界一流的领先IP和高级设计解决方案组合，使我们的客户能够在英特尔领先的工艺技术上交付大容量、高性能和高能效的SoC。”
Fast-growing market segments, such as AI/ML, HPC and premium mobile computing, require the latest standards in IP to take advantage of advanced packaging and silicon process technologies. Cadence's leading-edge implementations of trailblazing standards, such as advanced memory protocols, PCI Express, UCI Express and others for these key segments, enable joint customers to achieve scalable, high-performance designs that accelerate their time to market in IFS' most advanced silicon technologies and 3D-IC packaging capabilities.
快速增长的细分市场，如人工智能/机器学习、高性能计算和高端移动计算，需要最新的知识产权标准才能利用先进的封装和硅工艺技术。Cadence对这些关键细分市场的开拓性标准（例如高级存储器协议、PCI Express、UCI Express和其他标准）的领先实施使共同客户能够实现可扩展的高性能设计，从而加快其采用IFS最先进的硅技术和3D-IC封装能力的上市时间。
Building a world-class foundry business is key to Intel's IDM 2.0 strategy, and this agreement strengthens IFS' offerings by making an additional portfolio of essential design tools, flows and interface IP available for foundry customers. It builds on Intel's engagement with other industry-leading IP providers as it continues to grow the IP ecosystem for IFS customers.
建立世界一流的代工业务是英特尔IDM 2.0战略的关键，该协议通过向代工客户提供额外的基本设计工具、流程和接口IP组合，加强了IFS的产品组合。它建立在英特尔与其他行业领先的知识产权提供商合作的基础上，继续为IFS客户发展知识产权生态系统。
About Intel
关于英特尔
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore's Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers' greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better. To learn more about Intel's innovations, go to newsroom.intel.com and intel.com.
英特尔（纳斯达克股票代码：INTC）是行业领导者，致力于创造改变世界的技术，推动全球进步并丰富生活。受摩尔定律的启发，我们不断努力推进半导体的设计和制造，以帮助客户应对最大的挑战。通过将智能嵌入到云端、网络、边缘和各种计算设备中，我们释放了数据的潜力，使商业和社会变得更好。要了解有关英特尔创新的更多信息，请访问 新闻编辑室.intel.com 和 intel.com。
About Cadence
关于 Cadence
Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world's most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For nine years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.
Cadence 是电子设计领域的关键领导者，建立在 30 多年的计算软件专业知识基础上。该公司运用其基本的智能系统设计策略来提供将设计概念变为现实的软件、硬件和IP。Cadence 的客户是世界上最具创新性的公司，他们为消费品、超大规模计算、5G 通信、汽车、移动、航空航天、工业和医疗保健等最具活力的市场应用提供从芯片到电路板再到系统的卓越电子产品。《财富》杂志连续九年将Cadence评为100家最佳工作公司之一。要了解更多，请访问 cadence.com。
2024 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. PCI Express and PCIe are registered trademarks of PCI-SIG. Universal Chiplet Interconnect Express and UCIe are trademarks of the UCIe Consortium. All other trademarks are the property of their respective owners.
2024 Cadence Design Systems, Inc. 全球版权所有。Cadence、Cadence 徽标和其他 Cadence 商标可在以下网址找到 www.cadence.com/go/m 是 Cadence Design Systems, Inc. 的商标或注册商标 PCI Express 和 PCIe 是 PCI-SIG 的注册商标。Universal Chiplet Interconnect Express 和 UCie 是 UCie 联盟的商标。所有其他商标均为其各自所有者的财产。
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