Reported Earlier, SK Hynix And TSMC Collaborate On HBM4 Development And Next-Generation Packaging Technology
Reported Earlier, SK Hynix And TSMC Collaborate On HBM4 Development And Next-Generation Packaging Technology
早些时候报道，SK海力士和台积电合作开发HBM4和下一代封装技术
- SK hynix and TSMC sign MOU to collaborate on HBM4 development and next-generation packaging technology
- SK hynix will adopt TSMC's cutting-edge foundry process to advance HBM4 performance
- Product Design-Foundry-Memory trilateral collaboration to break memory performance limits for AI applications
- SK 海力士和台积电签署谅解备忘录，合作开发 HBM4 和下一代封装技术
- SK 海力士将采用台积电的尖端铸造工艺来提高 HBM4 性能
- 产品设计-Foundry-Memory三方合作打破人工智能应用的存储器性能限制