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Earnings Call Summary | ASMPT LTD(ASMVF.US) Q1 2024 Earnings Conference

Earnings Call Summary | ASMPT LTD(ASMVF.US) Q1 2024 Earnings Conference

财报电话会议摘要 | ASMPT LTD (ASMVF.US) 2024 年第一季度财报发布会
moomoo AI ·  04/24 05:14  · 电话会议

The following is a summary of the ASMPT Limited (ASMVF) Q1 2024 Earnings Call Transcript:

以下是ASMPT有限公司(ASMVF)2024年第一季度财报电话会议记录的摘要:

Financial Performance:

财务业绩:

  • ASMPT reported Q1 revenue of US$401.4 million, down 7.8% quarter-on-quarter.

  • Gross margin declined slightly by 40 basis points quarter-on-quarter to 41.9%.

  • Adjusted Q1 net profit was HK$177.5 million, up 132.1% quarter-on-quarter, with adjusted earnings per share up 138.9% quarter-on-quarter.

  • ASMPT reported a robust balance sheet with HK$5.25 billion in cash and bank deposits.

  • ASMPT公布的第一季度收入为4.014亿美元,同比下降7.8%。

  • 毛利率同比小幅下降40个基点至41.9%。

  • 调整后的第一季度净利润为1.775亿港元,同比增长132.1%,调整后的每股收益同比增长138.9%。

  • ASMPT报告了强劲的资产负债表,现金和银行存款为52.5亿港元。

Business Progress:

业务进展:

  • Bookings grew by 17% in Q1, primarily driven by Advanced Packaging solutions across both SEMI and SMT divisions.

  • Progress noted in automotive applications, forming a large proportion of total Group revenue.

  • Plans revealed to capitalize on Advanced Packaging solutions, which have the highest growth potential.

  • Product development ongoing, with the recent delivery of a next-generation ultra-fine-pitched TCB tool for chip-to-wafer applications.

  • ASMPT has a robust Advance Packaging momentum, which improves the company's SMT margin mix.

  • Increase of interest noted in photonics application, providing a comprehensive range of tools for transceiver packaging applications.

  • The company plans to invest HK$250 million in R&D and infrastructure, with a focus on the AP side.

  • The total addressable market (TAM) for AP is projected to increase up to HK$3.3 billion in 2028, with a significant compound annual growth rate.

  • 第一季度预订量增长了17%,这主要是由SEMI和SMT部门的先进封装解决方案推动的。

  • 汽车应用取得进展,占集团总收入的很大比例。

  • 公布了利用具有最大增长潜力的先进封装解决方案的计划。

  • 产品开发仍在继续,最近交付了用于芯片到晶圆应用的下一代超细间距 TCB 工具。

  • ASMPT拥有强劲的先进封装势头,这改善了该公司的SMT利润结构。

  • 人们对光子学应用的兴趣与日俱增,为收发器封装应用提供了全面的工具。

  • 该公司计划在研发和基础设施上投资2.5亿港元,重点放在亚太方面。

  • 预计到2028年,亚太地区的总潜在市场(TAM)将增加至33亿港元,复合年增长率很高。

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