Earnings Call Summary | BE SEMICONDUCTOR INDUSTRIES NV ORD EUR0.91 (NY REG SHARES)(BESIY.US) Q1 2024 Earnings Conference
Earnings Call Summary | BE SEMICONDUCTOR INDUSTRIES NV ORD EUR0.91 (NY REG SHARES)(BESIY.US) Q1 2024 Earnings Conference
The following is a summary of the BE Semiconductor Industries N.V. (BESIY) Q1 2024 Earnings Call Transcript:
以下是BE半导体工业公司(BESIY)2024年第一季度财报电话会议记录摘要:
Financial Performance:
财务业绩:
BE Semiconductor reported Q1 revenue of €146.3 million, up 9.7% year-on-year.
Order trends decreased by 10.1% compared to Q1 the previous year and declined by 23.3% sequentially.
Net income, adjusted for share-based compensation, increased by 15.1% to €49.5 million compared to the same quarter last year.
Gross margins increased by 3.0 points to 67.2% due to a favorable product mix and net forex benefits.
Expenses were controlled with increased R&D spending to support next-generation product development.
Net cash increased by 60.1% from the year-end to reach €180.9 million.
BE Semiconductor公布的第一季度收入为1.463亿欧元,同比增长9.7%。
与去年第一季度相比,订单趋势下降了10.1%,环比下降了23.3%。
经股份薪酬调整后的净收入与去年同期相比增长了15.1%,达到4,950万欧元。
由于良好的产品组合和净外汇收益,毛利率增长了3.0个百分点至67.2%。
通过增加研发支出来控制开支,以支持下一代产品开发。
净现金比年底增长了60.1%,达到1.809亿欧元。
Business Progress:
业务进展:
BE Semiconductor is expanding its advanced packaging market share in 2.5D, 3D, and photonics applications to cater to expected strong growth for AI-related applications.
The company anticipates orders for 25 to 35 hybrid bonding systems in Q2.
BE Semiconductor is increasing R&D investment in assembly processes to capitalize on anticipated growth in the period 2024, 2025 and 2027.
The company's progress on its hybrid bonders has been positive and a second TC system has recently been shipped and is being installed.
BESIY plans to have the 50 nanometer system ready by the end of 2025 and is evaluating both TCB and hybrid bonding for smartphone applications.
BE Semiconductor正在扩大其在2.5D、3D和光子学应用中的先进封装市场份额,以满足人工智能相关应用的预期强劲增长。
该公司预计,第二季度将订购25至35套混合粘合系统。
BE Semiconductor正在增加对装配工艺的研发投资,以利用2024、2025年和2027年期间的预期增长。
该公司在混合粘合机方面的进展是积极的,第二套TC系统最近已出货并正在安装中。
BESIY计划在2025年底之前准备好50纳米系统,并正在评估智能手机应用的TCB和混合粘合。
Tips: This article is generated by AI. The accuracy of the content can not be fully guaranteed. For more comprehensive details, please refer to the IR website. The article is only for investors' reference without any guidance or recommendation suggestions.
提示:本文由 AI 生成。无法完全保证内容的准确性。欲了解更多详情,请访问投资者关系网站。本文仅供投资者参考,不构成任何投资建议。