MediaTek's Dimensity 7300 Chips Level Up AI and Mobile Gaming for High-Tech Smartphones and Foldables
MediaTek's Dimensity 7300 Chips Level Up AI and Mobile Gaming for High-Tech Smartphones and Foldables
HSINCHU, May 29, 2024 /PRNewswire/ -- MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of ultra-efficient 4nm chips for high-tech mobile offerings. Providing best-in-class power efficiency and excellent performance, the Dimensity 7300 chipsets enable effortless multitasking, superior photography, accelerated gaming, and AI-enhanced computing; additionally, the Dimensity 7300X is designed with flip-style foldable devices in mind, providing support for dual displays.
新竹，2024年5月29日 /PRNewswire/ — 联发科今天宣布推出天准7300和天准7300X，这是两款用于高科技移动产品的超高效4纳米芯片。Dimensity 7300 芯片组提供一流的能效和卓越的性能，可实现轻松的多任务处理、卓越的摄影、加速游戏和人工智能增强型计算；此外，Dimensity 7300X 在设计时考虑了翻盖式可折叠设备，支持双显示屏。
Both MediaTek Dimensity 7300 chipsets have an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5GHz paired with 4X Arm Cortex-A55 cores. The 4nm process provides up to 25% lower power consumption in the A78 cores compared to the Dimensity 7050. The CPU works together with the latest Arm Mali-G615 GPU and a suite of MediaTek HyperEngine optimizations to accelerate gaming experiences. In comparison to competitor alternatives, the Dimensity 7300 series offers 20% faster FPS and 20% improved energy efficiency. To further enhance gaming experiences, the new chips utilize smart resource optimization, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.
两款联发科天际 7300 芯片组都有一个八核 CPU，由 4 个 Arm Cortex-A78 内核组成，运行频率高达 2.5GHz，搭配 4 个 Arm Cortex-A55 内核。与 Dimensity 7050 相比，4nm 工艺使 A78 内核的功耗降低了多达 25%。该CPU与最新的Arm Mali-G615 GPU和一系列联发科HyperEngine优化配合使用，可加速游戏体验。与竞争对手的替代产品相比，天准7300系列的FPS速度提高了20％，能效提高了20％。为了进一步增强游戏体验，新芯片利用智能资源优化，优化 5G 和 Wi-Fi 游戏连接，并通过双链路真无线立体声音频支持蓝牙 LE 音频技术。
"The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game," said Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business. "Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support."
联发科无线通信业务副总经理李延奇博士表示：“联发科天际 7300 芯片对于集成最新的人工智能增强和连接功能非常重要，这样消费者就可以无缝地进行直播和玩游戏。”“此外，Dimensity 7300X支持双显示屏，使原始设备制造商能够开发创新的新外形。”
The Dimensity 7300 chipsets also offer upgraded photography with the MediaTek Imagiq 950, featuring a premium-grade 12-bit HDR-ISP with support for a 200MP main camera. Enhanced with new hardware engines providing precise noise reduction (MCNR), face detection (HWFD), and video HDR, the Dimensity 7300 lets users capture stunning images and videos in any lighting. Additionally, live focus photo performance is up to 1.3X faster and photo remastering is up to 1.5X faster than the Dimensity 7050. Users can also record 4K HDR video with over 50% wider dynamic range compared to competitor solutions, bringing out more details in videos.
天准7300芯片组还通过联发科Imagiq 950提供升级版摄影功能，采用高级12位HDR-ISP，支持200万像素主摄像头。Dimensity 7300 采用了提供精确降噪 (MCNR)、人脸检测 (HWFD) 和视频 HDR 的新硬件引擎，可让用户在任何光线下捕捉令人惊叹的图像和视频。此外，实时对焦照片性能比天准7050快1.3倍，照片重制速度最高可快1.5倍。与竞争对手的解决方案相比，用户还可以录制4K HDR视频，其动态范围比竞争对手的解决方案要宽50％以上，从而在视频中呈现出更多细节。
The MediaTek APU 655 significantly boosts AI task efficiency, delivering twice the performance of the Dimensity 7050. The Dimensity 7300 chips also accommodate new mixed precision data types to more efficiently utilize memory bandwidth and reduce memory requirements for larger AI models.
联发科APU 655显著提高了人工智能任务效率，其性能是天痕7050的两倍。Dimensity 7300 芯片还可容纳新的混合精度数据类型，以更有效地利用内存带宽并降低更大 AI 模型的内存需求。
With MediaTek's MiraVision 955 built-in, the Dimensity 7300 SoCs support impressively detailed WFHD+ displays with 10-bit true color, along with support for global HDR standards, enhancing media streaming and playback. Additionally, the dedicated support for dual display flip phones on the Dimensity 7300X makes it easier for OEMs to meet the growing market demand for innovative form factors.
天准7300 SoC内置联发科的MiraVision 955，支持细节令人印象深刻的10位真彩WFHD+显示屏，同时支持全球HDR标准，增强了媒体直播和播放效果。此外，Dimensity 7300X 对双显示屏翻盖手机的专门支持使 OEM 更容易满足市场对创新外形规格不断增长的需求。
Other key features of the Dimensity 7300 and the Dimensity 7300X include:
天际 7300 和天际 7300X 的其他主要功能包括：
- MediaTek 5G UltraSave 3.0+ technology incorporating a complete suite of R16 power saving enhancements, plus MediaTek's own optimizations that provide between 13-30% greater power efficiency compared to competitor alternatives in common 5G sub-6GHz connectivity scenarios.
- Support for up to 3.27Gb/s 5G downlink via 3CC carrier aggregation, providing faster downlink speeds within urban and suburban environments.
- Tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connectivity.
- Dual 5G SIM support with dual VoNR to give users more choice.
- 联发科5G UltraSave 3.0+技术整合了一整套R16省电增强功能，加上联发科自己的优化，在常见的5G sub-6GHz连接场景中，与竞争对手的替代方案相比，能效提高了13-30％。
- 通过 3CC 载波聚合支持高达 3.27Gb/s 的 5G 下行链路，在城市和郊区环境中提供更快的下行链路速度。
- 三频段 Wi-Fi 6E 支持快速可靠的多千兆位无线连接。
- 支持双 5G SIM 卡和双 VonR，为用户提供更多选择。
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MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit for more information.
联发科公司（TWSE：2454）是一家全球性无晶圆厂半导体公司，每年支持近20亿台联网设备。我们在为移动、家庭娱乐、连接和物联网产品开发创新的片上系统 (SoC) 方面处于市场领导地位。我们对创新的执着使我们成为多个关键技术领域的市场推动力，包括高能效移动技术、汽车解决方案和一系列先进的多媒体产品，如智能手机、平板电脑、数字电视、5G、语音助手设备 (VAD) 和可穿戴设备。联发科赋能和激励人们通过智能技术扩大视野并实现目标，比以往任何时候都更轻松、更高效。我们与您喜爱的品牌合作，让所有人都能获得优秀的技术，它推动着我们所做的一切。访问以获取更多信息。
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