Synopsys Accelerates Chip Innovation With Production-Ready Multi-Die Reference Flow For Intel Foundry
Synopsys Accelerates Chip Innovation With Production-Ready Multi-Die Reference Flow For Intel Foundry
3DIC Compiler Co-Design and Analysis Solution Combined with Synopsys IP Accelerates Heterogeneous Integration for Intel Foundry's EMIB Technology
Synopsys的EDA软件-半导体IP与3DIC Compiler共同开发的解决方案加速了英特尔Foundry的EMIB技术异构集成。
Highlights
亮点
- Synopsys AI-driven multi-die reference flow now extended for Intel Foundry's EMIB advanced packaging technology accelerates quality-of-results for heterogeneous integration
- Synopsys 3DIC Compiler, a unified exploration-to-signoff platform, supports multi-die co-design of Intel Foundry's EMIB technology
- Synopsys IP for multi-die design supports efficient die-to-die connectivity and high memory bandwidth requirements
- Synopsys基于人工智能的多芯片参考流程现已扩展到英特尔Foundry的EMIB高级封装技术，加速异构集成的结果质量。
- Synopsys 3DIC编译器是一个统一的探索到签署平台，支持英特尔Foundry的EMIB技术的多芯片共同设计。
- Synopsys多芯片设计的IP支持高效的芯片对芯片连接和高内存带宽要求。
SUNNYVALE, Calif., June 24, 2024 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced the availability of its production-ready multi-die reference flow, powered by Synopsys.ai EDA suite, and Synopsys IP for Intel Foundry's embedded multi-die interconnect bridge (EMIB) advanced packaging technology. The optimized reference flow provides a unified co-design and analysis solution, enabled by Synopsys 3DIC Compiler to accelerate exploration and development of multi-die designs at all stages from silicon to systems. In addition, Synopsys 3DSO.ai is natively integrated with Synopsys 3DIC Compiler, enabling optimization for signal, power and thermal integrity with unparalleled productivity gains and maximum system performance.
2024年6月24日，加利福尼亚州旭阳市/PRNewswire——Synopsys（纳斯达克代码：SNPS）今天宣布，其由Synopsys.ai EDA套件提供技术支持的生产就绪多芯片参考流程，以及用于英特尔Foundry的嵌入式多芯片互连桥（EMIB）高级封装技术的Synopsys IP已经上市。优化的参考流程提供了一个统一的共同设计和分析解决方案，由Synopsys 3DIC Compiler提供支持，加速了从硅到系统的各个阶段的多芯片设计的探索和开发。此外，Synopsys 3DSO.ai与Synopsys 3DIC Compiler进行了本地集成，可实现信号、功率和热敏完整性的优化，具有无与伦比的生产力增益和最大的系统性能。