Cadence and Intel Foundry Collaborate on Systems Foundry Enablement for the AI Era
Cadence and Intel Foundry Collaborate on Systems Foundry Enablement for the AI Era
SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the achievement of several key milestones in its ongoing strategic partnership with Intel Foundry. Furthering the companies' collaboration on 3D-IC enablement, EDA flows and IP development across multiple Intel process nodes, beginning with Intel 18A Cadence announced the availability of a complete Embedded Multi-die Interconnect Bridge (EMIB) 2.5D advanced packaging flow, enhancements to the Intel 18A digital and custom/analog flows, a wide-ranging IP portfolio and the corresponding process design kits (PDKs) across various process nodes.
加州圣何塞——铿腾电子公司(纳斯达克股票代码:CDNS)今日宣布,在与英特尔工厂的战略伙伴关系中取得了几个关键里程碑。在3D-IC启用、EDA流程和IP开发方面,两家公司在多个英特尔工艺节点上继续合作,首先是英特尔18A。铿腾宣布可提供完整的嵌入式多芯片互连桥接(EMIB)2.5D高级封装流程,增强了英特尔18A数字和定制/模拟流程、广泛的IP资产组合,以及相应的各种过程设计工具包(PDK)在不同的处理节点上。
Key milestones of the ongoing Cadence-Intel Foundry collaboration include:
铿腾电子与英特尔工厂持续合作的关键里程碑包括:
- EMIB Reference Flow: The complete AI-driven Cadence flow, with Integrity 3D-IC Platform integrating Allegro X Advanced Package Designer (APD), Sigrity technologies, Clarity 3D Solver, Pegasus Verification System, and Virtuoso Studio, constitutes Intel's advanced packaging reference flow that leverages its EMIB technology and is optimized to work seamlessly with Intel 18A technology. The advanced EMIB 2.5D reference flow enables customers to successfully complete full-flow heterogeneous designs, seamlessly transitioning from system-level planning, physical optimization and analysis to DRC-aware implementation and physical signoff, with unmatched productivity and time to market.
- Digital Full-Flow for Intel 18A: The complete AI-driven Cadence RTL-to-GDS flow has been certified and optimized for Intel 18A technology featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery, enabling customers to meet their challenging PPA targets. The full flow includes the AI-driven Cadence Cerebrus Intelligent Chip Explorer, Genus Synthesis Solution, InnovusImplementation System, QuantusExtraction Solution, Quantus Field Solver, Tempus Timing Solution, Pegasus Verification System, Liberate Characterization, and Voltus IC Power Integrity Solution.
- Custom/Analog Flow for Intel 18A: Cadence's AI-based Virtuoso Studio, Spectre Simulation Platform, Voltus-XFi Custom Power Integrity Solution and EMX Planar 3D Solver have all been certified for Intel 18A. Virtuoso Studio is integrated with the Innovus Implementation System, enabling a complete implementation methodology for mixed-signal designs. Virtuoso Studio supports the features required to complete complex analog/mixed signal designs such as automatic device and standard cell place-and-route (P&R), assisted device editing capabilities, integrated EM-IR checks, integrated signoff-quality parasitic extraction and integrated signoff-quality physical verification, delivering efficient design and layout implementation on the Intel 18A process.
- Design IP for Intel 18A: Cadence's leading-edge implementations of trailblazing standards for advanced high-performance computing (HPC) and artificial intelligence and machine learning (AI/ML) applications enable joint customers to achieve scalable, high-performance designs that accelerate time to market in Intel Foundry's most advanced silicon technologies and 3D-IC packaging capabilities. Cadence Design IP for Intel 18A technology includes the enterprise-class PCI Express (PCIe) 6.0 and Compute Express Link (CXL), multi-standard PHY for LPDDR5X/5 8533Mbps to enable a diverse set of memory applications, Universal Chiplet Interconnect Express (UCIe) to boost multi-die system in package integration and 112G extended long-reach SerDes for superior bit error rate (BER) performance.
- EMIB参考流程:完整的基于人工智能的铿腾流程,与Integrity 3D-IC平台集成的Allegro X高级封装设计师(APD),Sigrity技术,Clarity 3D求解器,Pegasus验证系统,以及Virtuoso Studio,组成了英特尔高级封装参考流程,利用其EMIB技术进行了优化,可无缝地与英特尔18A技术配合使用。高级EMIB 2.5D参考流程使客户能够成功完成全流程异构设计,从系统级规划、物理优化和分析到DRC感知的实现和物理签署,生产力和上市时间无与伦比。与 Integrity3D-IC平台集成Allegro X高级封装设计师(APD) X爱文思控股封装设计软件Sigrity技术SigrityClarity 3D求解器, Pegasus验证系统Virtuoso Studio, Pegasus验证系统和Virtuoso Studio,构成英特尔先进封装的参考流程
- 英特尔18A的数字全流程:完整的人工智能驱动的Cadence RTL-to-GDS流程已经通过认证并针对英特尔18A技术进行了优化,该技术采用了RibbonFET全环绕晶体管和PowerVia背面供电,从而使客户能够实现具有挑战性的PPA目标。该完整的流程包括人工智能驱动的Cadence Cerebrus智能芯片探索器, Genus综合解决方案, Innovus实施系统, Quantus提取方案,Quantus场求解器,Tempus定时方案,飞马验证系统,特性化,为英特尔18A量身打造的定制/模拟流程:和VoltusIC功率完整性解决方案.
- Cadence基于人工智能的SpectreVirtuoso Studio, 仿真平台Voltus-XFi定制功率完整性方案, EMX Planar 3D 求解器和页面。已全部通过18A认证。Virtuoso Studio已与Innovus实现系统集成,为混合信号设计提供完整的实现方法论。Virtuoso Studio支持完成复杂的模拟/混合信号设计所需的功能,如自动器件和标准单元布局布线(P&R)、辅助器件编辑能力、集成的 EM-IR 检查、集成的签出质量寄生抽取和集成的签出质量物理验证,为英特尔18A工艺的设计和布局实现提供高效的支持。全部通过英特尔18A认证。Virtuoso Studio集成了Innovus实现系统,为混合信号设计提供完整的实现方法。Virtuoso Studio支持完成复杂的模拟/混合信号设计所需的功能,例如自动器件和标准单元的布局与布线(P&R)、辅助器件编辑能力、集成EM-IR检查、集成签署质量寄生抽取和集成签署质量物理验证,在Intel 18A过程中提供高效的设计和布局实现。
- 用于英特尔18A的设计IP:Cadence针对先进的高性能计算(HPC)和人工智能(AI)和机器学习(ML)应用的创新标准的领先实现,使联合客户能够在英特尔晶体管最先进的技术和3D-IC封装能力中实现可扩展的高性能设计,加快推向市场的时间。Cadence Design IP针对英特尔的18A技术包括企业级的PCI Express(PCIe)6.0和计算表达式链路(CXL),支持多种标准LPDDR5X/5 8533Mbps的多标准PHY,以实现多样化的内存应用Universal Chiplet Interconnect Express (UCIe)以提升多芯片系统封装集成和112G扩展长达的SerDes优异误码率(BER)性能“我们与Intel Foundry在3D-IC实现、EDA流程和IP方面的密切合作为共同开发复杂的AI芯片和电子系统的客户带来了显著的成果,”Cadence的定制IC和PCB Group高级副总裁兼总经理Tom Beckley说。“完整EMIB 2.5D高级封装流程和其他关键里程碑的可用性展示了我们伙伴关系的强大和我们交付下一代系统创新的承诺。”)“系统级探索和优化的挑战需要从RTL到封装、板和系统的协同设计和优化,”英特尔foundry的VP&GM、生态技术办公室Suk Lee说。“我们依赖Cadence作为关键生态系统合作伙伴之一,在追求成为AI时代的系统工厂的过程中提供最佳AI驱动的EDA解决方案和IP技术。”Cadence是电子系统设计中的关键领导者,凭借30多年的计算软件专业知识以建立起来。该公司应用其基础智能系统设计策略,提供软件、硬件和IP,并将设计理念变成现实。Cadence的客户是全球最具创新性的公司,从芯片到电路板再到最具动态市场应用(包括超大规模计算、5G通信、汽车、移动、航空航天、消费、工业和医疗)的完整系统,交付了非凡的电子产品。《财富》杂志连续10年将Cadence评为100强公司之一。了解更多请访问优异误码率(BER)性能的112G扩展长达SerDes
"Our close collaboration with Intel Foundry on 3D-IC enablement, EDA flows and IP is yielding significant results for mutual customers developing complex AI-enabling semiconductors and electronic systems," said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group at Cadence. "The availability of the complete EMIB 2.5D advanced packaging flow and other key milestones demonstrate the strength of our partnership and our commitment to delivering next-generation system innovations."
“我们与Intel Foundry在3D-IC实现、EDA流程和IP方面的密切合作为共同开发复杂的AI芯片和电子系统的客户带来了显著的成果,”Cadence的定制IC和PCB Group高级副总裁兼总经理Tom Beckley说。“完整EMIB 2.5D高级封装流程和其他关键里程碑的可用性展示了我们伙伴关系的强大和我们交付下一代系统创新的承诺。”
"The challenges of system-level exploration and optimization require co-design and co-optimization from RTL through package, board and system," said Suk Lee, VP & GM, Ecosystem Technology Office, Intel Foundry. "We rely on Cadence as one of the key ecosystem partners to deliver best-in-class AI-powered EDA solutions and IP technology in pursuit of our goal to be a systems foundry for the AI era."
“系统级探索和优化的挑战需要从RTL到封装、板和系统的协同设计和优化,”英特尔foundry的VP&GM、生态技术办公室Suk Lee说。“我们依赖Cadence作为关键生态系统合作伙伴之一,在追求成为AI时代的系统工厂的过程中提供最佳AI驱动的EDA解决方案和IP技术。”
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Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world's most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For 10 years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.
Cadence是电子系统设计中的关键领导者,凭借30多年的计算软件专业知识以建立起来。该公司应用其基础智能系统设计策略,提供软件、硬件和IP,并将设计理念变成现实。Cadence的客户是全球最具创新性的公司,从芯片到电路板再到最具动态市场应用(包括超大规模计算、5g概念通信、汽车、移动、航空航天、消费、工业和医疗)的完整系统,交付了非凡的电子产品。《财富》杂志连续10年将Cadence评为100强公司之一。了解更多请访问cadence.com.
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