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STMicroelectronics at Electronica China 2024: Cutting-edge Technologies and Innovative Solutions for Automotive, Industrial, Personal Electronics and Cloud Infrastructure

STMicroelectronics at Electronica China 2024: Cutting-edge Technologies and Innovative Solutions for Automotive, Industrial, Personal Electronics and Cloud Infrastructure

意法半导体参加 2024 年中国电子展:为汽车、兴业证券、个人电子和云基础建设提供前沿技术和创新解决方案。
意法半导体 ·  07/05 00:00

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, will exhibit at electronica China 2024(Booth E4.4600)on8-10 July. Under the theme of "Our technology starts with You", ST will showcase a comprehensive portfolio of innovative solutions across Automotive, Industrial, Personal Electronics and Cloud Infrastructure, featuring over 50 interactive demos and advanced solutions, each tailored to meet the evolving needs of our customers and the market.

全球半导体领先企业,STMicroelectronics (NYSE: STM) 将于2024年7月8-10日亮相electronica China 2024(展位E4.4600) 。以“Our technology starts with You”为主题,ST将展示涵盖汽车,工业,个人电子和云基础架构的创新解决方案及技术案例。本次展出将呈现逾50个交互式演示和先进解决方案,并针对客户和市场的不断变化,个性化定制不同的解决方案。

Automotive: With over 30 years' experience in automotive electronics, ST is a reliable and innovative partner for building the future of smart e-mobility. ST's comprehensive solutions span the e-mobility value chain. From electric powertrains to digital vehicle platforms, ST technologies make electric transportation safer, cleaner, and more advanced. At electronica China, ST will demonstrate its complete automotive solutions by showcasing two electric-vehicle models. Visitors can explore ST's wide range of applications for car electrification and digitalization, from Powertrain for Electric Vehicles (EV), Chassis and Safety, Body and Convenience, to Telematics and Infotainment.

汽车:拥有30年的汽车电子开发经验,ST是智能电动汽车未来值得信赖和创新的合作伙伴。ST的全面解决方案目前覆盖了电动动力总成、数字化车辆平台等电动汽车方方面面,让电动出行更加安全,清洁和先进。在electronica China的展出中,ST将通过展示两款电动汽车热力学模型展示其全面的汽车解决方案。参观者可以了解ST在电动化和数字化车辆领域广泛应用,包括新能源汽车(NEV)的动力总成、底盘和安全性,车身和便利性,远程通信和信息娱乐系统等。

Electrification is a major development trend in China's automotive market, with a prosperous growth in the NEV (new energy vehicle) market segment, accompanied by an increasing demand for convenient NEV charging solutions. ST's latest automotive-charging solution integrates On Board Charger (OBC) and DC-DC converter built with STPOWER products enabling compatibility with different power levels like 6.6kW, 11kW, or even 22kW. It features ST's Stellar E1 40nm microcontroller technology based on the ARM architecture, delivering high efficiency and reliability through high and flexible power computing cores with rich analog components and the highest functional safety level.

电动化是中国汽车市场的重要发展趋势,随着新能源汽车市场的繁荣增长,NEV充电需求不断增长。ST的最新汽车充电解决方案与内置STM32 MCU和 STPOWER器件的DC/DC转换器技术相结合, 确保了适配多种不同功率水平和不同充电协议下的充电需求,如6.6kW、11kW甚至22KW的功率输出。除此之外,该解决方案还采用了基于ARM架构的ST Stellar E1 40nm微控制器技术,具备计算内核,先进的模拟技术以及最高功能安全级别,从而确保了极高的效率和可靠性。

Another innovation ST will showcase at electronica China is the ADAS – Intelligent Front View Camera Solution, developed in collaboration with ST's partners. This solution incorporates a range of ST's technologies, including the SPC58NN automotive MCU and the L9396 System Basis Chip (SBC). The combination of an MCU and an SBC enables customers to meet the stringent safety requirements of ASIL-D when creating advanced ADAS products.

电动汽车领域另一个ST将在electronica China展示的创新解决方案是ADAS-前视智能摄像头解决方案,这是ST与合作伙伴共同开发的产品。这个方案涵盖了一系列ST技术,包括SPC58NN的汽车MCUs和L9396系统基础芯片(SBC) 。MCU和SBC的结合使得客户在创建先进的ADAS产品时可以满足ASIL-D所提出的严格的安全性需求。

Industrial: With increasing concerns around climate change and energy costs, stakeholders, such as states, companies, and individuals, globally are prioritizing green-energy sustainable practices. ST is at the forefront of driving a greener future by developing sustainable solutions in a sustainable way. At electronica China, visitors are invited to witness a one-of-a-kind "energy-wall" that shows a comprehensive hybrid energy system. It illustrates the entire energy-conversion chain, from generation and storage to distribution and consumption, through various components and devices including PV solar panels, inverters, a Battery Management System (BMS), a bi-directional energy-storage system, and EV charging systems.

工业:随着对气候变化和能源成本的日益关注,全球各地的政府、公司和个人优先考虑,推进绿色、可持续的做法。ST在可持续的方式下,处于推动创造拥有多种可持续解决方案的未来发展这样的前沿。在electronica China,访客可以查看“能量墙”技术,其是一项全面的混合能源系统,能够体现从能源发电,储存,分配和消费的全部过程,展示了各种不同的部件和设备的应用,包括光伏电池板、逆变器、电池管理系统 (BMS)、双向能量存储系统和电动汽车 (EV) 充电系统等。

Reliable and efficient power is critical for datacenters supporting AI/cloud workloads. Using its cutting-edge technologies such as STPOWER Gen3 SiC MOSFETs and silicon transistors (i.e. high voltage MOSFETs and IGBTs), galvanic isolation gate drivers, high precision op amps, current sensing amplifiers, and high-performance MCUs, ST showcases solutions that aim to boost energy efficiency while cutting consumption and carbon emissions.

数据中心对支持AI/云负荷的可靠和高效的电力至关重要。ST使用最先进的技术,包括STPOWER Gen3 SiC MOSFET和硅晶体管(例如高压 MOSFET和 IGBT)、电磁隔离门极驱动器、高精度运算放大器、电流检测放大器和高性能MCU等等,提供旨在提高能源效率,降低能耗和碳排放的解决方案。

Arc Fault Circuit Interrupter (AFCI) has been widely applied in new energy industries such as photovoltaics and energy storage. At electronica China, ST will present its AFCI solution, which leverages edge-AI algorithms based on the STM32H7 and STM32G4 MCUs to detect arc faults in real time. Compared to traditional mechanistic algorithms, the AI algorithm integrated with the STM32 technology offers significantly higher accuracy and reduced false-alarm rates. The data training from a customer on-site and the upgrading of the STM32 AFCI 2.0 algorithm can lead to higher accuracy in the inference results.

电弧故障电路中断器 (AFCI) 在新能源产业,如光伏和储能等方面被广泛应用。在electronica China中,ST将展示基于STM32H7和STM32G4 MCU的边缘AI算法的AFCI解决方案。与传统的机械式算法相比,使用了STM32的AI算法方案具有更高的准确率和较低的误报率。在客户现场的数据训练和STM32 AFCI 2.0算法的更新后,将会得到更高的推理准确性。


Personal Electronics and Cloud Infrastructure: With the widespread adoption of NFC functionality in smartphones in recent years, an increasing number of brands are leveraging NFC to enhance consumer interaction and brand loyalty. High-end brands, high-value products, including luxury goods and artworks, require more secure NFC tag solutions to prevent counterfeiting. At this exhibition, ST also introduces its latest ST25TA-E NFC tag chip with state-of-the-art security features bringing innovation to the market with its on-chip ECDSA (Elliptic Curve Digital Signature Algorithm) capabilities and compatibility with Blockchain standards. Building on the Edge TruST25 digital-signature feature, the ST25TA-E includes an ECC cryptographic engine, providing a more secure digital-signature solution that can offer significant assistance in product-identity verification and digital twinning.


个人电子产品与云基础架构:近年来,随着智能手机中NFC功能的广泛应用,越来越多的品牌都在利用NFC技术增强消费者互动和销售策略。高端品牌和高价值产品需要更加安全的NFC标签,以防止伪造。在本展览中,ST还将推出最新的ST25TA-E NFC标签芯片,具备最先进的安全功能,并带来诸如On-chip ECDSA(椭圆曲线数字签名算法)能力等创新特性,确保符合区块链标准。建立在TruST25数字签名功能之上, ST25TA-E包括ECC加密引擎,提供更安全的数字签名方案,可以在产品身份验证和数字孪生方面提供显着的帮助。

Showcased at electronica China, ST's new third-generation duel full-scale MEMS pressure sensor comes in a sealed, cylindrical, surface-mountable package. The sensor is demoed in a solution that combines high precision and low power consumption to accurately measure water depth and altitude for IoT, sports, and wearable-device applications. It features a ceramic substrate that provides high resistance to liquid permeability and a robust potting gel, proven in automotive applications, to protect the internal circuitry.

ST的新一代双全量程MEMS压力传感器将展示一个密封的、圆柱形、可表面安装的解决方案。该传感器结合高精度和低功耗,可准确测量物体在Iot、体育和可穿戴设备应用中的海拔和水深。它采用陶瓷基板,具有很高的抗液体渗透性,以及一种经过汽车应用浸泡实验的坚固封胶材料,以保护内部电路。

Improving user experience is key to driving ST's continuous innovation. Powered by ST FlightSense Time-of-Flight technology, a smart-cup detection shown at electronica China can detect and measure cups of various sizes, shapes, and materials, as well as their positions and the liquid level inside, thanks to the Compact Normalized Histograms feature. With this technology, users can use cups of any size and shape without worrying about spills due to poor fit.

提高用户体验是推动ST不断创新的关键。由St FlightSense Time-of-Flight技术提供支持的智能杯检测解决方案将展示如何检测和测量各种大小、形状、材质的杯子以及其位置和内部的液位,而Compact Normalized Histograms技术则确保有效的使用不同大小和形状的杯子,不用担心因不合适体积的杯子而洒出液体。

A binocular 3D camera will be on show using one of our ST BrightSense global-shutter image sensors, which have just been launched on the open-market, to make this unique technology available to all, after having delivered > 1Bu image sensors to selected partners.

一个双目3D摄像头将展示利用St BrightSense全局快门图像传感器实现的技术,其已经在开放市场上推出,在成功为一些合作伙伴提供一亿个图像传感器之后,现在可以使这种独特的技术面向市场。

Presentations:
In addition to exciting demonstrations, ST's experts will take the stage at electronica China to deliver 6 insightful presentations. These sessions will span a wide array of cutting-edge topics, offering deep dives into the latest trends and innovations that are shaping the future of technology:

展会演讲:除了激动人心的演示外,ST的专家们还将在electronica China展台上演讲,分享6个深度探究前沿技术和未来趋势的主题,涵盖各种各样的前沿话题:ST的边缘AI解决方案,ST的碳化硅MOSFEt技术路线图和在中国的市场策略,ST电机控制开发生态系统和系统解决方案,智能驾驶的解决方案,STM32数字电源和ESS的解决方案,以及STM32WBA55中的Bluetooth LE音频-Auracast。
除了令人兴奋的演示外,意法半导体的专家们还将在中国电子展上台发表6场富有洞见的演讲。这些会议涵盖了各种尖端话题,深入探讨了塑造未来科技的最新趋势和创新。

  • ST's Edge AI Solutions
  • ST's Silicon Carbide MOSFET Technology Roadmap and Market Strategy in China
  • ST motor control development ecosystem and system solution introduction
  • The Solution of Intelligent Driving
  • STM32 Solution in Digital Power and ESS
  • Bluetooth LE Audio – Auracast with STM32WBA55
  • ST的边缘AI解决方案
  • ST的碳化硅MOSFEt技术路线图和在中国的市场策略
  • ST电机控制开发生态系统和系统解决方案
  • 智能驾驶的解决方案
  • STM32数字电源和ESS的解决方案
  • Bluetooth LE音频-Auracast与STM32WBA55

For an in-depth exploration of these captivating demonstrations, please visit ST's booth (Booth E4.4600)at electronica China 2024. You can also check some of our use-case solutions at our event page.

若想深入探索这些令人着迷的演示,请于electronica China 2024期间前往ST展台(展位号E4.4600)。您也可以在我们的活动页面上查看一些解决方案。

About STMicroelectronics
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at .

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在意法半导体,我们超过50,000名半导体技术创造者和制造商,掌握半导体供应链的最新工艺制造设施。作为一家集成器件制造商,我们与超过200,000个客户和数千个合作伙伴一起设计和构建产品、解决方案和生态系统,以应对他们的挑战和机遇,解决支持更可持续的世界的需求。我们的技术实现了更智能的移动性、更高效的功率和能源管理,以及大规模部署云连接的自主物联网。我们致力于在2027年之前实现成为一家在范围1和2以及部分范围3上实现碳中和的目标。更多信息,请访问.

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