Onto Innovation Unveils Advanced Glass Substrate Solutions for AI and Cloud Computing
Onto Innovation Unveils Advanced Glass Substrate Solutions for AI and Cloud Computing
onto innovation推出用于人工智能和云计算服务商的先进玻璃衬底解决方案
Onto Innovation Inc. (NYSE:ONTO) today announced Onto Innovation's glass substrate suite featuring the JetStep X500 panel-level packaging lithography system with hybrid substrate handling capabilities and the Firefly G3 sub-micron automatic metrology and inspection system for panel-level packaging and advanced IC substrates (AICS). The JetStep X500 and Firefly G3 systems offer customers a complete panel-level packaging solution supporting heterogeneous integration (HI) chiplet packages for AI, high performance compute and cloud computing. The AICS market is expected to increase at a compound annual growth rate of 10% from 2023 to 2028, according to Prismark.
Onto Innovation Inc.（NYSE:ONTO）今日宣布 Onto Innovation 的玻璃基板套件，包括 JetStep X500 面板级封装光刻系统（具有混合基板处理功能）和 Firefly G3 亚微米自动计量和检测系统，用于面板级封装和高级 IC 基板（AICS）。JetStep X500 和 Firefly G3 系统为客户提供了完整的面板级封装解决方案，支持异构集成（HI）芯片组包装，用于 AI、高性能计算和云计算。根据 Prismark，AICS 市场预计从 2023 年到 2028 年以 10% 的复合年增长率增长。
The AICS HI roadmap is rapidly approaching several new...
AICS HI 路...
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