Adeia Wins ECTC Award for Paper on "Fine Pitch Die-to-Wafer Hybrid Bonding"
Adeia Wins ECTC Award for Paper on "Fine Pitch Die-to-Wafer Hybrid Bonding"
SAN JOSE, Calif.--(BUSINESS WIRE)--Jul. 10, 2024-- Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and media technology sectors to market, was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on May 28-31, 2024.
Adeia Inc. (Nasdaq: ADEA)是一家领先的研究和开发及知识产权许可公司,在半导体和媒体技术领域推出创新产品而闻名。该公司近日荣获2024年5月28日至31日于科罗拉多州丹佛市举办的Electronic Components and Technology Conference(ECTC)的最佳演讲论文奖。
Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for "Fine Pitch Die-to-Wafer Hybrid Bonding," which explores the range of parameters associated with implementing hybrid bonding technology in high-volume manufacturing processes.
Adeia的高级首席工程师Thomas Workman博士撰写的《Fine Pitch Die-to-Wafer Hybrid Bonding》论文荣获奖项。该论文探讨了在高产量制造过程中实现混合绑定技术所涉及到的一系列参数范围。
"As adoption of hybrid bonding accelerates, there is rising demand for practical information and guidance on implementing the technology in high volume manufacturing. This paper provides a detailed pathway for manufacturers to understand the parameters, limitations and yield considerations of hybrid bonding, ultimately enabling industry leaders to successfully implement the technology in their own processes," said Dr. Workman.
Workman博士表示:“随着混合绑定技术的应用加速,人们对在高生产过程中实施该技术的实用信息和指导的需求也日益增长。本文提供了详细的制造商了解混合绑定的参数、限制和产量考虑因素的途径,最终使行业领导人能够成功地将技术应用于自己的工艺流程中。”
Hybrid bonding technology in advanced 2.5 and 3D packaging has rapidly gained traction in the semiconductor industry to enhance performance and scalability. Advanced packaging architectures integrate multiple semiconductor components into a single package or module to create functional systems. Within the package or module, a chip-to-chip interconnect is formed with hybrid bonding to deliver the highest bandwidth with low latency.
在2.5和3D先进封装中采用混合绑定技术已经在半导体行业中迅速崭露头角,以增强性能和可扩展性。先进的封装架构将多个半导体元件集成到单个封装或模块中,以创建功能系统。在封装或模块内,通过混合绑定形成芯片与芯片之间的互连,以提供最高带宽和最低延迟。
Hybrid bonding represents a significant advancement in semiconductor technology, particularly in terms of performance per watt.
混合绑定代表了半导体技术的显著进步,尤其在每瓦性能方面。
"By enabling faster processing within established thermal limits, hybrid bonding enhances efficiency and reduces energy consumption," explained Dr. Workman. "It achieves this by facilitating higher interconnect density than alternatives like micro-bumps, thereby improving bandwidth and lowering latency. Higher density of interconnections between the memory die and logic chip improves performance and efficiency while offering better thermal connectivity."
Workman博士解释道:“通过在占据更高空间的情况下来提升互连密度,混合绑定实现了比微小隆起更多的互联密度,从而提高了带宽并降低了延迟。内存板和逻辑芯片之间交叉口的更高堆积密度提高了性能和效率,同时提供更好的散热连通性。”
Looking ahead, Dr. Workman stated that hybrid bonding is gaining increasing traction in high-volume manufacturing applications. Interest and activity in hybrid bonding are expected to grow as progress is made in shrinking the pitch to a submicron level.
展望未来,Workman博士表示,混合绑定技术正在高产量制造应用中不断发展。因此预计混合绑定的兴趣和活动将随着间距缩小到亚微米水平而增加。
"This would allow hybrid bonding to be a solution for an even wider range of applications. The next step is demonstrating how hybrid bonding can be implemented with standard equipment and processes. This will expand the practical opportunities to leverage the full benefits of this technology," he concludes.
他总结道:“这将使混合绑定成为解决更广泛应用领域的技术之一。下一步将展示如何使用标准设备和工艺实施混合绑定技术。这将扩大实际机会,以利用这种技术的全部优势。”
With over 20 years of experience in process and equipment engineering, Dr. Workman has successfully launched and managed fabrication and assembly lines for semiconductors, photonics, solar cells and nanotechnology. He is known for his excellent problem-solving skills as well has his deep knowledge of materials and manufacturing systems.
Workman博士拥有20多年的工艺和设备工程经验,成功地推出并管理了半导体、光子学、太阳能电池和纳米技术的制造和组装流水线。他以出色的解决问题的能力和深厚的材料和制造系统知识而闻名。
About Adeia
关于Adeia
Adeia is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. Adeia's fundamental innovations underpin technology solutions that are shaping and elevating the future of digital entertainment and electronics. Adeia's IP portfolios power the connected devices that touch the lives of millions of people around the world every day as they live, work and play. For more, please visit .
Adeia是一家领先的R&D和知识产权许可公司,加速了媒体和半导体行业中创新技术的采用。Adeia的基本创新支持着塑造和提升数字娱乐和电子行业未来的技术解决方案。 Adeia的知识产权组合为连接设备提供动力,这些设备每天都触及全球数百万人的生活、工作和娱乐。
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