Resonac Announces New US-JOINT Consortium; Ten Partners to Collaborate on Next-Generation Semiconductor Packaging in Silicon Valley
Resonac Announces New US-JOINT Consortium; Ten Partners to Collaborate on Next-Generation Semiconductor Packaging in Silicon Valley
The consortium will help to further advance technology in back-end packaging, an area that has not been significantly focused on in the US
该联盟将帮助进一步推动后端封装技术的发展，而后端封装领域在美国并未得到高度关注
UNION CITY, Calif. – July 8, 2024 – Resonac Corporation today unveiled a new consortium of ten partners, called "US-JOINT," for its semiconductor back-end process R&D in Silicon Valley. The ten American and Japanese semiconductor materials and equipment companies are: Azimuth; KLA; Kulicke & Soffa; Moses Lake Industries; MEC; ULVAC; NAMICS; TOK; TOWA; and Resonac.
加利福尼亚州联合城——2024年7月8日——Resonac Corporation今天宣布成立了一个由十个合作伙伴组成的新联盟，名为 “US-Joint”，用于其在硅谷的半导体后端工艺研发。美国和日本的十家半导体材料和设备公司是：Azimuth、KLA、Kulicke & Soffa、Moses Lake Industries、MEC、ULVAC、NAMICS、TOK、TOWA和Resonac。
US-JOINT expands the activities of Japan-based open consortiums led by Resonac (known as "JOINT" and "JOINT2") in the U.S. and includes the participation of five U.S.-based companies. US-JOINT R&D will take place at a new R&D center in Union City, Calif., set up through co-investment with the partners. The construction of cleanrooms and equipment installation will begin this year, and the facility is expected to be fully operational in 2025.
US-Joint扩大了由Resonac（称为 “JOINT” 和 “JOINT2”）牵头的日本开放财团在美国的活动，包括五家美国公司的参与。美国的联合研发将在加利福尼亚州联合市的新研发中心进行，该中心是通过与合作伙伴共同投资设立的。洁净室的建设和设备安装将于今年开始，该设施预计将于2025年全面投入运营。
Mr. Rahm Emanuel, the U.S. Ambassador to Japan, said, "With nearly every area of our daily lives now dependent on semiconductors, it is critical that we strengthen supply chains through cooperation with trusted partners in the sector. This new consortium of leading American and Japanese companies in the semiconductor industry is the latest example of our two nations joining forces to accelerate the development of advanced technologies of global importance."
美国驻日本大使拉姆·伊曼纽尔说：“现在我们日常生活的几乎每个领域都依赖半导体，因此通过与该领域值得信赖的合作伙伴合作来加强供应链至关重要。这个由美国和日本半导体行业领先公司组成的新联盟是我们两国联手加速开发具有全球重要性的先进技术的最新例子。”
US-JOINT is an open consortium designed for end-customer collaboration to verify the latest requirements for semiconductor packaging of advanced devices and validate new concepts in development. In addition, by co-creating with customers, Resonac and the US-JOINT members will capture market needs in real time, accelerating the R&D of materials and equipment technologies.
US-Joint 是一个开放式联盟，专为终端客户合作而设计，旨在验证先进器件半导体封装的最新要求并验证开发中的新概念。此外，通过与客户共同创造，Resonac和美国联合成员将实时捕捉市场需求，加速材料和设备技术的研发。
"Today's rapidly expanding next-generation semiconductors for generative AI and autonomous driving require new approaches to advanced packaging technologies, such as 2.5D and 3D*1," said Hidenori Abe, executive director of Electronics Business Headquarters, Resonac. "In recent years, major semiconductor manufacturers and fabless companies in Silicon Valley, including GAFAM*2, are designing semiconductors in-house and creating new concepts in back-end packaging one after another. This is where the US-JOINT consortium can contribute significantly with our leading technology in materials and equipment on-shore in the U.S."
Resonac电子业务总部执行董事安倍秀典表示：“当今用于生成式人工智能和自动驾驶的下一代半导体迅速扩展，需要采用新的方法来开发先进的封装技术，例如2.5D和3D*1。”“近年来，硅谷的主要半导体制造商和无晶圆厂公司，包括GAFAM*2，都在内部设计半导体，并陆续在后端封装中创造新的概念。这是美国联合财团可以利用我们在美国陆上材料和设备方面的领先技术做出重大贡献的地方。”
Advanced packaging and back-end processing of semiconductors has traditionally been located primarily in Asia. Bringing packaging R&D closer to major semiconductor device makers in Silicon Valley will help to further advance the technology and solve technical issues, especially in the areas that other U.S. consortiums do not cover enough, including advancements in the substrate, interposer and fabrication of the package.
半导体的先进封装和后端处理传统上主要位于亚洲。拉近封装研发与硅谷主要半导体器件制造商的距离，将有助于进一步推进该技术并解决技术问题，尤其是在其他美国财团覆盖不够的领域，包括衬底、中介层和封装制造方面的进步。
Jan Vardaman, president, TechSearch International, Inc., said, "This represents a tremendous opportunity for U.S. companies to take advantage of the expertise gathered in material and equipment for advanced packaging development."
TechSearch International, Inc. 总裁扬·瓦尔达曼表示：“这为美国公司提供了一个利用在先进封装开发材料和设备方面积累的专业知识的巨大机会。”
For details, please refer to the website, Resonac Holdings Corporation:
详情请浏览Resonac Holdings公司网站：
*1 2.5D packaging is a technology to place semiconductor chips in parallel on the interposer. 3D packaging is a technology to laminate chips with TSV (through silicon via).
*2 GAFAM stands for Google, Apple, Facebook, Amazon, Microsoft.
*1 2.5D 封装是一种将半导体芯片并行放置在中介层上的技术。3D 封装是一种使用 TSV（通过硅通孔）层压芯片的技术。
*2 GaFam 代表谷歌、苹果、脸书、亚马逊、微软。