Reported Earlier, Adeia And Hamamatsu Photonics Enters Long-Term Hybrid Bonding License Agreement
Reported Earlier, Adeia And Hamamatsu Photonics Enters Long-Term Hybrid Bonding License Agreement
据报道，Adeia和浜松光子学公司签订了长期混合键合许可协议。
This new license supplements Hamamatsu's existing license to Adeia's DBI wafer-to-wafer hybrid bonding and ZiBond wafer-to-wafer direct bonding technologies and follows from a prior development license between the parties that included a DBI Ultra die-to-wafer hybrid bonding technology transfer.
这个新许可证补充了浜松现有的使用 Adeia 的 DBI 晶片对晶片混合键合和 ZiBond 晶片对晶片直接键合技术的许可证，并且是在双方之前签署包括 DBI Ultra 晶片对晶片混合键合技术转让的开发许可证之后实现的。
资讯热榜
更新时间