Texas Instruments Inks Preliminary Agreement To Get Up To $1.6B In Chips And Science Act Proposed Funding For Semiconductor Manufacturing In Texas & Utah; Company To Get $6B-$8B From U.S. Department of Treasury's Investment Tax Credit
Texas Instruments Inks Preliminary Agreement To Get Up To $1.6B In Chips And Science Act Proposed Funding For Semiconductor Manufacturing In Texas & Utah; Company To Get $6B-$8B From U.S. Department of Treasury's Investment Tax Credit
德州仪器签署初步协议，获得高达16亿美元的芯片和半导体制造科学法案提议的资金，该公司将从美国财政部的投资税收抵免中获得60亿至80亿美元。
- The U.S. Department of Commerce has proposed up to $1.6 billion for TI in direct funding through the CHIPS and Science Act to support three 300mm semiconductor wafer fabs under construction in Texas and Utah.
- TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury's Investment Tax Credit for qualified U.S. manufacturing investments.
- The company also expects to receive $10 million in proposed funding for workforce development, as it creates over 2,000 new TI jobs and thousands of indirect jobs for construction, suppliers and supporting industries.
- 美国商务部提出通过CHIPS和Science法案，向TI直接提供高达16亿美元的资金，以支持在德克萨斯州和犹他州正在施工的三个300毫米半导体晶圆厂。
- TI希望从美国财政部的投资税收抵免计划中获得大约60亿至80亿美元的资金，以资助符合要求的美国制造业投资。
- 该公司还预计将获得1000万美元的提议资金用于职业发展，因其将创造超过2000个新的TI就业机会和成千上万个施工、供应商和支持产业的间接就业机会。