GCT Semiconductor Signs MOU With Global Tier One Telecommunications Supplier To Collaborate On The Development Of Fixed Wireless Access Technology Using GCT's 5G Solutions Including Modem Chipset And RFIC
GCT Semiconductor Signs MOU With Global Tier One Telecommunications Supplier To Collaborate On The Development Of Fixed Wireless Access Technology Using GCT's 5G Solutions Including Modem Chipset And RFIC
The Agreement with Global Tier One Supplier Includes Development Collaboration on Fixed Wireless Access Devices Using GCT's 5G Chipsets
与全球一线供应商的协议包括使用GCT的5G芯片组开发固定无线接入设备的合作。
GCT Semiconductor Holding Inc. ("GCT" or the "Company") (NYSE:GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, announced today the execution of a memorandum of understanding ("MOU") with a tier one worldwide infrastructure and terminal provider (the "Tier One Supplier") to collaborate on the development of Fixed Wireless Access ("FWA") technology using GCT's 5G solutions including modem chipset and RFIC. The Company expects to close a definitive agreement before the end of 2024.
GCt半导体控股有限公司（“GCT”或“公司”）（纽交所：GCTS）是一家领先的5G和4G半导体解决方案的设计和供应商，今天宣布与一家全球基础设施和终端供应商（“一线供应商”）签署谅解备忘录（“MOU”），合作开发使用GCT的5G解决方案，包括调制解调器芯片组和射频集成电路的固定无线接入技术。公司预计将在2024年底前签署一份最终协议。
