Xpeng's chip is a centralized computing architecture chip that supports powering the cockpit and smart driving, with AI computing power close to the level of 3 mainstream smart driving chips, according to local media.
Xpeng's (NYSE: XPEV) in-house developed smart driving chip has been successfully taped out, making it the next local automaker to see this achievement after Nio (NYSE: NIO).
Local media outlet 36kr reported the development today, citing a person familiar with the matter as saying that the chip is specifically designed for AI (artificial intelligence) needs and end-to-end large models.
The chip is a centralized computing architecture chip that supports driving smart cockpits and smart driving, with AI computing power close to the level of 3 mainstream smart driving chips, according to the report.
Xpeng will officially release information about the in-house developed chip at its 10th anniversary celebration and Mona M03's launch event on August 27, the report said.
Xpeng will launch the first model of the Mona array, the M03, on August 27, which will be its cheapest model.
The Xpeng Mona M03 will start at no more than RMB 135,900 ($19,080), the company said earlier this month.
Tape-out is a technical term used in the chip industry, which refers to the process of transforming a circuit design into a chip that can be produced on an assembly line after the chip design has been completed.
After a successful tape-out, a chip prototype can begin mass production if it passes subsequent tests.
Nio unveiled the Shenji NX9031 at Nio Day 2023 held on December 23, 2023, and the chip will be used in the ET9 executive flagship sedan. The sedan is already available for pre-order, but deliveries won't start until the first quarter of 2025.
At the Nio IN 2024 Tech Day event in Shanghai on July 27, Nio announced that the Shenji NX9031 chip had successfully taped out.
Li showed a prototype of the Shenji NX9031 chip at the time, claiming that the performance of one chip is comparable to that of four of the industry's flagship chips.
Xpeng moved ahead of both Nio and Li Auto (NASDAQ: LI) in its efforts to develop its own chips, starting to build its team in 2020, which is currently between 200-300 people in size, according to the report in 36kr today.
The computing power design of Xpeng's chip is tied to its use of big end-to-end models for autonomous driving. The company launched its end-to-end smart driving large model on May 20 that can be used in production vehicles.
Xpeng now knows where the computing power should be used, so it will be more sophisticated in its thinking about computing power allocation, the report said, citing an insider.
Li Auto also has a chip project codenamed "Schumacher," which started later than Nio and Xpeng, but would also tape out within the year, according to a July 9 report by 36kr.
($1 = RMB 7.1225)
Nio IN 2024: Autonomous driving chip, SkyOS, 2nd-gen Nio Phone, and more
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小鹏汽车的芯片是一种集中式计算架构芯片,支持驾驶舱和智能驾驶的供电,其人工智能计算能力接近于3款主流智能驾驶芯片的水平,据当地媒体报道。
小鹏汽车(NYSE: XPEV)自主研发的智能驾驶芯片已成功投片,成为继纽交所(NYSE: NIO)蔚来汽车之后看到这一成就的下一个本地汽车制造商。
当地媒体36氪今日报道了这一发展,援引一位知情人士称,该芯片专门为人工智能(AI)需求和端到端大模型设计。
据报道,这是一个支持驾驶智能座舱和智能驾驶的集中式计算架构芯片,其AI计算能力接近于3款主流智能驾驶芯片的水平。
报告称,小鹏将在其第10周年庆典和Mona M03上市活动上正式发布自主研发的芯片信息,时间为8月27日。
小鹏将于8月27日推出Mona系列的第一款车型M03,这将是其最廉价的车型。
小鹏Mona M03的起售价将不超过人民币135,900元(19,080美元),该公司本月早些时候表示。
Tape-out是芯片行业中使用的一个技术术语,指在芯片设计完成后将电路设计转换成可在生产线上制造的芯片的过程。
如果成功完成tape-out,则芯片原型机可以开始大规模生产,但需通过接下来的测试。
NIO在2023年12月23日举行的NIO Day 2023上发布了Shenji NX9031芯片,该芯片将用于ET9行政旗舰轿车。该轿车已经可以进行预订,但交付要等到2025年第一季度才会开始。
在2024年7月27日上海的Nio IN 2024科技日活动上,Nio宣布Shenji NX9031芯片已经成功脱模。
Li在当时展示了Shenji NX9031芯片的原型,并声称该芯片的性能相当于行业旗舰芯片的四倍。
小鹏在2020年开始建立自己的芯片团队,并已超越NIO和理想汽车(纳斯达克: LI),目前团队规模在200-300人左右,根据36kr今天的报道。
小鹏的芯片计算能力设计与其使用端到端大模型来进行自动驾驶密切相关。该公司于5月20日推出了其端到端智能驾驶大模型,可在生产车辆中使用。
小鹏现在知道了计算能力应该用在哪里,因此在计算能力分配方面将会更加精密,引述内部人士的报道称。
理想汽车也有一个代号为"舒马赫"的芯片项目,虽然开始较晚于NIO和小鹏,但根据36kr 7月9日的报道,该项目也将在今年内脱模。
(1美元 = 7.1225人民币)
Nio在2024年的计划:自主驾驶芯片、SkyOS、第二代Nio手机等等。
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小鹏汽车蒙娜M03发布会将于北京时间8月27日晚7点开始