Mobilint Debut New AI Chips at Silicon Valley Summit
Mobilint Debut New AI Chips at Silicon Valley Summit
SEOUL, South Korea, Sept. 9, 2024 /PRNewswire/ -- Mobilint, an edge AI chip company led by CEO Dongjoo Shin, is set to make waves at the upcoming AI Hardware & Edge AI Summit 2024 in Silicon Valley. The three-day event, starting on September 10th, will showcase Mobilint's latest innovations in AI chip technology. The company will demonstrate live demos of its high-efficiency SoC 'REGULUS' for on-device AI and high-performance acceleration chip 'ARIES' for on-premises AI.
韩国首尔，2024年9月9日 /PRNewswire/ — 由首席执行官申东珠领导的边缘人工智能芯片公司Mobilint将在即将在硅谷举行的2024年人工智能硬件与边缘人工智能峰会上大放异彩。为期三天的活动将于9月10日开始，将展示Mobilint在人工智能芯片技术方面的最新创新。该公司将现场演示其用于设备端人工智能的高效 SoC “REGULUS” 和用于本地人工智能的高性能加速芯片 “ARIES”。
The AI Hardware Summit is an annual event where global IT giants such as Microsoft, NVIDIA, Google, Meta, and AMD, along with prominent startups, gather to share their developments in AI and machine learning. This year's summit features world-renowned AI experts as speakers, including Andrew Ng, CEO of Landing AI, and Mark Russinovich, CTO of Microsoft Azure.
人工智能硬件峰会是一年一度的盛会，微软、英伟达、谷歌、Meta和AMD等全球IT巨头以及知名初创公司齐聚一堂，分享他们在人工智能和机器学习方面的发展。今年的峰会邀请了世界知名的人工智能专家作为演讲嘉宾，包括Landing AI首席执行官安德鲁·吴和微软Azure首席技术官马克·鲁西诺维奇。
Mobilint has secured one of only seven exclusive workshop sessions at the event, joining the ranks of industry leaders such as AMD, Intel, Qualcomm, and SambaNova. The company plans to introduce two of its AI chips. Notably, REGULUS will be unveiled for the first time in the global market at this event. The Mobilint workshop session is receiving an enthusiastic response, to the point that reservations have already closed.
Mobilint在活动中获得了仅有的七场独家研讨会中的一场，加入了AMD、英特尔、高通和SambaNova等行业领导者的行列。该公司计划推出两款人工智能芯片。值得注意的是，REGULUS将在本次活动中首次在全球市场上亮相。Mobilint研讨会获得了热烈的反响，以至于预订已经截止。
REGULUS is a standalone AI SoC designed to deliver AI computing performance of over 10 TOPS while consuming less than 3W of power. It integrates high-performance CPU, codec, and ISP components, making it suitable for applications in robotics, drones, home appliances, dash cameras, and CCTV systems.
REGULUS 是一款独立的人工智能 SoC，旨在提供超过 10 TOPS 的人工智能计算性能，同时消耗不到 3W 的功耗。它集成了高性能 CPU、编解码器和 ISP 组件，使其适用于机器人、无人机、家用电器、行车记录仪和闭路电视系统中的应用。
Additionally, Mobilint plans to debut a Software Development Kit (SDK) tutorial to the public during the workshop and aims to establish a platform later this year that allows developers to test products in a web environment.
此外，Mobilint计划在研讨会期间向公众发布软件开发套件（SDK）教程，并计划在今年晚些时候建立一个平台，允许开发人员在网络环境中测试产品。
Mobilint shared that it will conduct the tape-out for its first product, ARIES, later this month. The mass production of ARIES is targeted for January next year, and pre-orders are currently open.
Mobilint表示，它将在本月晚些时候进行其首款产品ARIES的录制。ARIES的批量生产定于明年1月，目前正在开放预订。
CEO Dongjoo Shin said, "We aim to transparently showcase the actual performance, versatility, and usability of our AI semiconductors at this event, proving our technological competitiveness. We are committed to challenging the global market based on trust and mutual growth with our customers."
首席执行官申东珠说：“我们的目标是在本次活动中透明地展示我们的人工智能半导体的实际性能、多功能性和可用性，以证明我们的技术竞争力。我们致力于在与客户的信任和共同增长的基础上挑战全球市场。”
SOURCE Mobilint, Inc.
来源 Mobilint, Inc.