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STMicroelectronics Unveils New Generation of Silicon Carbide Power Technology Tailored for Next-generation EV Traction Inverters

STMicroelectronics Unveils New Generation of Silicon Carbide Power Technology Tailored for Next-generation EV Traction Inverters

意法半导体推出针对下一代电动汽车牵引逆变器量身定制的新一代碳化硅功率技术
GlobeNewswire ·  09/24 09:00

STMicroelectronics unveils new generation of silicon carbide power technology tailored for next-generation EV traction inverters

意法半导体推出专为下一代电动汽车牵引逆变器量身定制的新一代碳化硅功率技术

  • Smaller, more efficient products to ramp-up in volumes through 2025 across 750V and 1200V classes, will bring the advantages of silicon carbide beyond premium models to mid-size and compact electric vehicles.
  • ST plans to introduce multiple silicon carbide technology innovations through 2027, including a radical innovation.
  • 更小、更高效的产品将在2025年之前增加750V和1200V等级的产量,这将为中型和紧凑型电动汽车带来超越高端车型的碳化硅的优势。
  • 意法半导体计划在2027年之前推出多项碳化硅技术创新,包括一项激进的创新。

Geneva, Switzerland, September 24, 2024 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is introducing its fourth generation STPOWER silicon carbide (SiC) MOSFET technology. The Generation 4 technology brings new benchmarks in power efficiency, power density and robustness. While serving the needs of both the automotive and industrial markets, the new technology is particularly optimized for traction inverters, the key component of electric vehicle (EV) powertrains. The company plans to introduce further advanced SiC technology innovations through 2027 as a commitment to innovation.

瑞士日内瓦,2024年9月24日——为各种电子应用客户提供服务的全球半导体领导者意法半导体(纽约证券交易所代码:STM)正在推出其第四代STPOWER碳化硅(SiC)MOSFET技术。第 4 代技术为能效、功率密度和稳健性带来了新的基准。在满足汽车和工业市场需求的同时,这项新技术特别针对牵引逆变器进行了优化,牵引逆变器是电动汽车 (EV) 动力系统的关键组件。该公司计划在2027年之前推出更多先进的碳化硅技术创新,以此作为对创新的承诺。

"STMicroelectronics is committed to driving the future of electric mobility and industrial efficiency through our cutting-edge silicon carbide technology. We continue to advance SiC MOSFET technology with innovations in the device, advanced packages, and power modules," said Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group. "Together with our vertically integrated manufacturing strategy, we are delivering industry leading SiC technology performance and a resilient supply chain to meet the growing needs of our customers and contribute to a more sustainable future."

“意法半导体致力于通过我们尖端的碳化硅技术推动电动汽车和工业效率的未来。我们将通过器件、先进封装和功率模块的创新继续推进碳化硅mosFET技术的发展。” 微机电系统和传感器集团模拟、功率和分立器件总裁Marco Cassis说。“结合我们的垂直整合制造战略,我们将提供行业领先的碳化硅技术性能和弹性供应链,以满足客户不断增长的需求,为更可持续的未来做出贡献。”

As the market leader in SiC power MOSFETs, ST is driving further innovation to exploit SiC's higher efficiency and greater power density compared to silicon devices. This latest generation of SiC devices is conceived to benefit future EV traction inverter platforms, with further advances in size and energy-saving potential. While the EV market continues to grow, challenges remain to achieve widespread adoption and car makers are looking to deliver more affordable electric cars. 800V EV bus drive systems based on SiC have enabled faster charging and reduced EV weight, allowing car makers to produce vehicles with longer driving ranges for premium models. ST's new SiC MOSFET devices, which will be made available in 750V and 1200V classes, will improve energy efficiency and performance of both 400V and 800V EV bus traction inverters, bringing the advantages of SiC to mid-size and compact EVs — key segments to help achieve mass market adoption. The new generation SiC technology is also suitable for a variety of high-power industrial applications, including solar inverters, energy storage solutions and datacenters, significantly improving energy efficiency for these growing applications.

作为碳化硅功率 MOSFET 的市场领导者,St 正在推动进一步的创新,以利用 SiC 与硅器件相比更高的效率和更大的功率密度。这种最新一代的碳化硅器件旨在使未来的电动汽车牵引逆变器平台受益,同时进一步提高尺寸和节能潜力。尽管电动汽车市场持续增长,但要实现广泛采用仍然存在挑战,汽车制造商正在寻求提供更实惠的电动汽车。基于碳化硅的800V电动汽车总线驱动系统实现了更快的充电速度并减轻了电动汽车的重量,使汽车制造商能够为高端车型生产续航里程更长的汽车。意法半导体的新型SiC MosFET器件将提供750V和1200V等级,将提高400V和800V电动汽车总线牵引逆变器的能效和性能,将SiC的优势带入中型和紧凑型电动汽车——帮助实现大众市场采用的关键细分市场。新一代碳化硅技术还适用于各种高功率工业应用,包括太阳能逆变器、储能解决方案和数据中心,显著提高了这些不断增长的应用的能源效率。

Availability
ST has completed qualification of the 750V class of the fourth generation SiC technology platform and expects to complete qualification of the 1200V class in the first quarter of 2025. Commercial availability of devices with nominal voltage ratings of 750V and 1200V will follow, allowing designers to address applications operating from standard AC-line voltages up to high-voltage EV batteries and chargers.

可用性
意法半导体已经完成了第四代碳化硅技术平台750V级别的认证,并预计将在2025年第一季度完成对1200V级别的认证。标称额定电压分别为750V和1200V的器件将实现商业上市,这使设计人员能够解决从标准交流线路电压到高压电动汽车电池和充电器运行的应用。

Use cases
ST's Generation 4 SiC MOSFETs provide higher efficiency, smaller components, reduced weight, and extended driving range compared to silicon-based solutions. These benefits are critical for achieving widespread adoption of EVs and leading EV manufacturers are engaged with ST to introduce the Generation 4 SiC technology into their vehicles, enhancing performance and energy efficiency. While the primary application is EV traction inverters, ST's Generation 4 SiC MOSFETs are also suitable for use in high-power industrial motor drives, benefiting from the devices' improved switching performance and robustness. This results in more efficient and reliable motor control, reducing energy consumption and operational costs in industrial settings. In renewable energy applications, the Generation 4 SiC MOSFETs enhance the efficiency of solar inverters and energy storage systems, contributing to more sustainable and cost-effective energy solutions. Additionally, these SiC MOSFETs can be utilized in power supply units for server datacenters for AI, where their high efficiency and compact size are crucial for the significant power demands and thermal management challenges.

用例
与硅基解决方案相比,意法半导体第4代SiC MOSFET具有更高的效率、更小的组件、更轻的重量和更大的驱动范围。这些优势对于实现电动汽车的广泛采用至关重要,领先的电动汽车制造商正在与意法半导体合作,将第四代碳化硅技术引入其车辆,从而提高性能和能源效率。虽然主要应用是电动汽车牵引逆变器,但意法半导体的第四代SiC MOSFET也适用于大功率工业电机驱动,这得益于这些器件的开关性能和稳健性得到改善。这可以提高电机控制的效率和可靠性,从而降低工业环境中的能耗和运营成本。在可再生能源应用中,第 4 代 SiC MOSFET 提高了太阳能逆变器和储能系统的效率,为更可持续和更具成本效益的能源解决方案做出了贡献。此外,这些 SiC MOSFET 可用于人工智能服务器数据中心的电源单元,其高效和紧凑的尺寸对于应对重大功率需求和热管理挑战至关重要。

Roadmap
To accelerate the development of SiC power devices through its vertically integrated manufacturing strategy, ST is developing multiple SiC technology innovations in parallel to advance power device technologies over the next three years. The fifth generation of ST SiC power devices will feature an innovative high-power density technology based on planar structure. ST is at the same time developing a radical innovation that promises outstanding on-resistance RDS(on) value at high temperatures and further RDS(on) reduction, compared to existing SiC technologies.

路线图
为了通过其垂直整合的制造战略加快碳化硅功率器件的开发,意法半导体正在并行开发多项碳化硅技术创新,以推动未来三年功率器件技术的发展。第五代St SiC功率器件将采用基于平面结构的创新型高功率密度技术。意法半导体同时正在开发一项根本性的创新,与现有的碳化硅技术相比,该创新有望在高温下具有出色的导通电阻RDS(on)值,并进一步降低导通电阻(导通)。

ST will attend ICSCRM 2024, the annual scientific and industry conference exploring the newest achievements in SiC and other wide bandgap semiconductors. The event, from September 29 to October 04, 2024, in Raleigh, North Carolina will include ST technical presentations and an industrial keynote on 'High volume industrial environment for leading edge technologies in SiC'. Find out more here: ICSCRM 2024 - STMicroelectronics.

意法半导体将参加ICsCRM 2024,这是年度科学和行业会议,探讨碳化硅和其他宽禁带半导体的最新成就。该活动将于2024年9月29日至10月4日在北卡罗来纳州罗利举行,将包括St技术演讲和主题为 “碳化硅前沿技术的大批量工业环境” 的行业主题演讲。在这里了解更多信息: ICSCRM 2024-意法半导体

Technical Note to Editors
The fourth generation SiC MOSFETs from STMicroelectronics represent a significant leap forward in power conversion technology compared to previous generations. These devices are engineered to deliver superior performance and robustness, addressing the stringent demands of future EV traction inverters. The Generation 4 SiC MOSFETs feature a significantly lower on-resistance (RDS(on)) measured against prior generations, minimizing conduction losses, and enhancing overall system efficiency. They offer faster switching speeds, which translate to lower switching losses, crucial for high-frequency applications and enabling more compact and efficient power converters. The Generation 4 technology provides extra robustness in Dynamic Reverse Bias (DRB) conditions, exceeding the AQG324 automotive standard, ensuring reliable operation under harsh conditions.

给编辑的技术说明
与前几代相比,意法半导体的第四代碳化硅MOSFET代表了功率转换技术的重大飞跃。这些设备经过精心设计,可提供卓越的性能和坚固性,可满足未来电动汽车牵引逆变器的严格要求。与前几代相比,第 4 代 SiC MOSFET 的导通电阻(RDS(on))明显降低,从而最大限度地减少了传导损耗,提高了整体系统效率。它们提供更快的开关速度,这意味着更低的开关损耗,这对于高频应用以及实现更紧凑、更高效的功率转换器至关重要。第 4 代技术在动态反向偏压 (DRB) 条件下提供了额外的稳定性,超过 AQG324 汽车标准,确保在恶劣条件下可靠运行。

With Generation 4 ST continues to deliver outstanding RDS(on) x die-area figure of merit to ensure high current-handling capability with minimal losses. The average die size of Generation 4 devices is 12-15% smaller than that of Generation 3, considering an RDS(on) at 25 degrees Celsius, allowing for more compact power converter designs, saving valuable space, and reducing system costs. The improved power density of these devices supports the development of more compact and efficient power converters and inverters, essential for both automotive and industrial applications. In addition, this is particularly beneficial for power supply units in server datacenters for AI, where space and efficiency are critical factors.

随着第 4 代的推出,St 继续提供出色的 RDS (on) x 芯片面积质量因数,从而确保高电流处理能力和最小损耗。考虑到 25 摄氏度时的 RDS(开),第 4 代设备的平均芯片尺寸比第 3 代器件小 12-15%,允许更紧凑的功率转换器设计,节省宝贵的空间并降低系统成本。这些器件功率密度的提高支持了更紧凑、更高效的功率转换器和逆变器的开发,这对于汽车和工业应用至关重要。此外,这对于人工智能服务器数据中心的电源单元特别有利,在这些设备中,空间和效率是关键因素。

As an industry leader in this technology, ST has already supplied STPOWER SiC devices for more than five million passenger cars worldwide in a range of EV applications including traction inverter, OBC (onboard charger), DC-DC converter, EV charging station, and e-compressor application, significantly enhancing the performance, efficiency, and range of NEVs. ST's SiC strategy, as an integrated device manufacturer (IDM), ensures quality and security of supply to serve carmakers' strategies for electrification. With the recently announced fully vertically integrated SiC substrate manufacturing facility in Catania, expected to start production in 2026, ST is moving quickly to support the rapid market transition towards e-mobility and higher efficiency in industrial applications.

作为该技术的行业领导者,意法半导体已经为全球超过500万辆乘用车提供STPOWER SiC器件,这些设备涉及一系列电动汽车应用,包括牵引逆变器、OBC(车载充电器)、DC-DC转换器、电动汽车充电站和电子压缩机应用,显著提高了新能源汽车的性能、效率和续航里程。作为集成设备制造商(IDM),意法半导体的碳化硅战略确保了供应的质量和安全性,以服务于汽车制造商的电气化战略。随着最近宣布的位于卡塔尼亚的完全垂直整合的碳化硅衬底制造工厂预计将于2026年开始生产,意法半导体正在迅速采取行动,以支持市场向电动汽车的快速过渡和工业应用中更高的效率。

For further information about ST's SiC portfolio, please visit

有关意法半导体碳化硅产品组合的更多信息,请访问

About STMicroelectronics
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at .

关于意法半导体
在意法半导体,我们有超过50,000名半导体技术的创造者和制造商,通过最先进的制造设施掌握半导体供应链。作为一家综合设备制造商,我们与20多万名客户和成千上万的合作伙伴合作,设计和构建产品、解决方案和生态系统,以应对他们的挑战和机遇,并满足支持更可持续世界的需求。我们的技术可实现更智能的出行、更高效的电力和能源管理,以及云连接的自主设备的大规模部署。我们致力于实现我们的目标,即到2027年实现范围1和范围2以及部分范围3的碳中和。更多信息可以在此处找到。

For further information, please contact:
INVESTOR RELATIONS:
Céline Berthier
Group VP, Investor Relations
Tel: +41.22.929.58.12
celine.berthier@st.com

欲了解更多信息,请联系:
投资者关系:
塞琳·伯蒂尔
集团投资者关系副总裁
电话:+41.22.929.58.12
celine.berthier@st.com

MEDIA RELATIONS:
Alexis Breton
Corporate External Communications
Tel: +33.6.59.16.79.08
alexis.breton@st.com

媒体关系:
亚历克西斯·布雷顿
企业对外沟通
电话:+33.6.59.16.79.08
alexis.breton@st.com

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  • C3283C - Sep 24 2024 -- SiC Gen4_FINAL FOR PUBLICATION
  • C3283C-2024 年 9 月 24 日--SiC Gen4_Final 待发布

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