Synopsys And TSMC Collaborate To Advance Trillion-Transistor AI And Multi-Die Chip Design With Optimized EDA And IP Solutions For N2 And A16 Processes; Address Thermal, Power, And System Performance Challenges
Synopsys And TSMC Collaborate To Advance Trillion-Transistor AI And Multi-Die Chip Design With Optimized EDA And IP Solutions For N2 And A16 Processes; Address Thermal, Power, And System Performance Challenges
新思科技和台积电合作，推进拥有万亿晶体管的人工智能和多芯片设计，通过优化的eda软件-半导体和IP解决方案，应对N2和A16工艺的热、功耗和系统性能挑战
Synopsys And TSMC Collaborate To Advance Trillion-Transistor AI And Multi-Die Chip Design With Optimized EDA And IP Solutions For N2 And A16 Processes; Address Thermal, Power, And System Performance Challenges
新思科技和台积电合作推进万亿晶体管人工智能和多芯片芯片设计，为N2和A16工艺提供优化的 EDA 和 IP 解决方案；应对散热、功率和系统性能挑战
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