Rapidus Establishes State-of-the-art Back-end Semiconductor Manufacturing Process Research-and-development Center
Rapidus Establishes State-of-the-art Back-end Semiconductor Manufacturing Process Research-and-development Center
Rapidus will begin installing manufacturing equipment in Rapidus Chiplet Solutions, a new R&D facility and clean room, will be located on Seiko Epson's Chitose campus
新的研发设施和洁净室Rapidus Chiplet Solutions将位于精工爱普生的千岁园区
TOKYO and HOKKAIDO, Japan, Oct. 3, 2024 /PRNewswire/ -- Rapidus Corporation, a company involved in the research, development, design, manufacture and sales of advanced logic semiconductors, today announced that it will set up a clean room within Seiko Epson Corporation's facility in Chitose, Hokkaido, and open a research-and-development (R&D) center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS).
日本东京和北海道，2024年10月3日 /PRNewswire/ — 参与先进逻辑半导体研究、开发、设计、制造和销售的公司Rapidus Corporation今天宣布，将在位于北海道千岁市的精工爱普生公司工厂内设立一个洁净室，并开设一个名为Rapidus Chiplet Solutions（RCS）的半导体后处理研发（R&D）中心。
The Seiko Epson Chitose Plant is adjacent to the Rapidus Innovative Integration for Manufacturing (IIM) foundry, the semiconductor manufacturing facility that Rapidus is currently building in Bibi, Chitose City. The new R&D space was unveiled at a groundbreaking ceremony held today, with the clean room amassing an area of approximately 9,000m2 (96,875 square feet). Leveraging the new R&D facility, Rapidus will develop mass production technologies for chiplet packages.
精工爱普生千岁工厂毗邻Rapidus创新制造整合（IIM）铸造厂，该铸造厂是Rapidus目前正在千岁市毕比建造的半导体制造工厂。新的研发空间在今天举行的奠基仪式上揭幕，洁净室占地面积约9,000平方米（96,875平方英尺）。利用新的研发设施，Rapidus将开发小芯片封装的批量生产技术。
Rapidus will begin installing manufacturing equipment in April 2025, with R&D activities scheduled to begin in April 2026. RCS will have pilot lines for the FCBGA, Si interposer, RDL, and hybrid bonding processes, and will conduct additional R&D on mass production technologies, including equipment automation.
Rapidus将于2025年4月开始安装制造设备，研发活动计划于2026年4月开始。RCS将拥有FCBGA、硅介质层、RDL 和混合键合工艺的试点生产线，并将对包括设备自动化在内的批量生产技术进行额外的研发。
In terms of the development of back-end processes and chiplet integration technologies, the Ministry of Economy, Trade and Industry and New Energy and Industrial Technology Development Organization approved the project for the "Development of Chiplet Package Design and Manufacturing Technology for 2nm Generation Semiconductors" in April 2024, and development of core technologies such as chiplet integration and 2.5D/3D packaging is progressing.
在后端工艺和芯片集成技术的开发方面，经济产业省和新能源与工业技术开发组织于2024年4月批准了 “开发2纳米代半导体的芯片封装设计和制造技术” 项目，芯片集成和2.5D/3D封装等核心技术的开发正在进行中。
In June 2024, Rapidus signed a partnership with IBM not only for front-end processes but for chiplet technology. In addition, Rapidus is collaborating with organizations across four countries, including LSTC, AIST, the University of Tokyo, Fraunhofer in Germany and A*STAR IME in Singapore to further packaging advancements.
2024年6月，Rapidus与IBM签署了合作伙伴关系，不仅涉及前端流程，还涉及小芯片技术。此外，Rapidus正在与四个国家的组织合作，包括LSTC、AiST、东京大学、德国弗劳恩霍夫和新加坡的A*STAR IME，以进一步推动包装进步。
About Rapidus Corporation:
Rapidus Corporation aims to develop and manufacture the world's most advanced logic semiconductors. We will create new industries together with our customers through the development and provision of services to shorten cycle times in design, wafer processes, 3D packaging and more. We will continue to challenge ourselves in order to contribute to the fulfillment, prosperity, and happiness of people's lives using semiconductors.
关于Rapidus Corporation：
Rapidus 公司的目标是开发和制造世界上最先进的逻辑半导体。我们将通过开发和提供服务，与客户一起创造新行业，以缩短设计、晶圆工艺、三维封装等方面的周期。我们将继续挑战自我，以便使用半导体为人们生活的充实、繁荣和幸福做出贡献。
About Rapidus Corporation
关于Rapidus Corporation
Headquarters: 4-1 Kojimachi, Chiyoda-ku, Tokyo 102-0083, Japan
总部：日本东京 102-0083 千代田区小路町 4-1
Founded: August 10, 2022
成立时间：2022年8月10日
Management: Tetsuro Higashi, Chairman of the Board of Directors
管理层：董事会主席东哲郎
Atsuyoshi Koike, President and Representative Director
总裁兼代表董事小池厚义
Business Areas: Research, development, design, manufacture, and sales of semiconductor devices, integrated circuits and other electronic components
业务领域：半导体器件、集成电路和其他电子元件的研究、开发、设计、制造和销售
Capital (as of November 2022): 7,346 million yen (includes capital reserves)
资本（截至2022年11月）：734600万日元（包括资本储备）
Media Contact:
Devan Gillick – Breakaway Communications for Rapidus
Email: [email protected]
Mobile: (530) 591-3194
媒体联系人：
Devan Gillick — Rapidus 的分离通讯
电子邮件：[电子邮件保护]
手机：(530) 591-3194
SOURCE Rapidus Corporation
来源 Rapidus Corporation