Amkor Technology, TSMC Sign MoU To Collaborate And Bring Advanced Packaging And Test Capabilities To Arizona
Amkor Technology, TSMC Sign MoU To Collaborate And Bring Advanced Packaging And Test Capabilities To Arizona
艾马克技术与爱文思控股签署谅解备忘录，合作在亚利桑那州推动先进封装和测试能力。
Under the agreement, TSMC will contract turnkey advanced packaging and test services from Amkor in their planned facility in Peoria, Arizona.
根据协议，TSMC将从亚光公司在其计划中的亚利桑那州皮奥里亚设施承包一揽子先进封装和测试服务。
TSMC will leverage these services to support its customers, particularly those using TSMC's advanced wafer fabrication facilities in Phoenix.
TSMC将利用这些服务来支持其客户，特别是那些使用TSMC在凤凰城的先进硅片制造设施的客户。
The close collaboration and proximity of TSMC's front-end fab and Amkor's back-end facility will accelerate overall product cycle times.
TSMC前端晶圆厂和亚光后端设施的紧密协作和接近将加快整体产品周期时间。