STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is exhibiting at Industrial Transformation Asia Pacific (ITAP 2024, Booth 3C07) on 14-16 October.

The booth will showcase more than 10 demos from ST and its ecosystem partners in key industrial markets addressing edge AI use-cases for industrial automation and IoT segments, sensors for smart buildings and machinery condition monitoring, an innovative use case of NFC-powered Electronic Circuit Board, Motor Control & Servo Drives with IO Link, STM32 & Graphics solutions, wireless-connectivity solutions with Matter, and power-management solutions with STSPIN.

NFC-powered Electronic Circuit Board (ECB): The NFC-powered ECB is an innovative solution from Deng Kai Sdn Bhd that incorporates multiple ST components, including an ST25R NFC reader and an ST25DV dynamic tag, together with a low-power STM32G0 microcontroller (MCU) and an LDO voltage regulator. It integrates energy harvesting through NFC technology, a first in the industry, using an antenna to capture the electromagnetic energy from an active NFC reader and converting it into electrical power. This technology offers convenience, sustainability, and cost-effectiveness for designs with low power consumption, eliminating the need for batteries.

Multi-pose estimation AI demo: ST provides X-Linux-AI open-source software ecosystem free of charge to support multiple different edge AI use cases in industrial automation and IoT segments. The demo is built around ST's 2nd-generation STM32MP2 microprocessor, which embeds secured and enhanced peripherals for connected applications.

Servo Drives Orchestra: This showstopper features a comprehensive motor-control demo comprising of 8 motor-control modules, which use 4 different reference designs with loads ranging from 500 W to 22 kW. Each of the motors controls a rope that pulls a load and demonstrates precision position control, in a harmonic movement coordinated simultaneously with the others. Each motor drive executes the commands sent by I/O link from the podium where an HMI interface allows to select the mode, and each of them collects temperature and vibration data, executes condition-monitoring algorithms, and wirelessly sends data to a Baidu cloud, which then informs back the system and its HMI to reflect how the systems behave and save power, among other things.

STSPIN for Motor Control: The EVSPIN32G4-DUAL is a demonstration board based on the STSPIN32G4 and STDRIVE101 for applications using two three-phase brushless motors. The STSPIN32G4 is a system-in-package integrating, in a 9×9 mm VFQFPN package, a triple high-performance half-bridge gate driver with a rich set of programmable features and one mixed-signal STM32G431 microcontroller. The STDRIVE101 is a triple half-bridge gate driver in a compact 4×4 VFQPN package featuring 600 mA current capability and embedded protection.

Sensors: ST's latest AI sensor devices for orientation and gesture-tracking (the LSM6DSO16IS for consumer and the ISM330IS for industrial) feature the Intelligent Sensor Processing Unit (ISPU) with an embedded DSP programable core. Users can port C code into the ISPU, enabling essential functions like Fast Fourier Transform (FFT) and AI solutions with tiny neural networks. This technology enhances the ability to monitor conditions and gestures effectively. The new generation of IMU sensors (the LSM6DSV for consumer) and the ISM330BX for industrial) delivers embedded sensor fusion, which processes motion data from accelerometers, gyroscopes, and external magnetometers. This provides quaternion output to track the orientation of an object in 3D space. The sensor-fusion library is also available in the STM32 library list, enhancing predictive tracking and gesture capabilities.

STM32 for Industrial Applications:

A wide variety of STM32 solutions will be on display including:

• Graphics solutions: From high-performance STM32H7 MCUs based on the 32-bit Arm Cortex-M7 core and running at up to 600 MHz, to ultra-low-power STM32U5 series offering advanced power-saving devices to meet the most demanding power/performance requirements for smart applications, including wearables, HMI, personal medical devices, home automation, and industrial sensors.
• Sustainable technology: The STM32U0 is the latest addition to the STM32 ultra-low power device range: an energy-conscious microcontroller that can reduce power consumption by up to 50% compared to previous product generations. This enables less frequent battery replacements, minimizes the impact of discarded batteries, and allows more designs to go battery free, running solely from an energy-harvesting system such as a small photovoltaic cell.
• Wireless Connectivity: ST portfolio covers all Matter device types, for its seamless interaction between connected smart homes and smart building devices across different IP technologies. Based on the STM32WB0 microcontroller, the Electronic Shelf Label (ESL) demo shows how to improve operational efficiency.

Fireside chat

ST is participating in this year's Industrial Transformation Forum to share how we are integrating AI in our manufacturing operations to make factories smarter, propelling manufacturing into a new era of efficiency, flexibility, and sustainability.

ST looks forward to contributing to important conversations and advancing the development of smart factories.

About STMicroelectronics
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at .