Aehr Test Systems to Present at The LD Micro Main Event XVII Investor Conference in Los Angeles on October 29, 2024
Aehr Test Systems to Present at The LD Micro Main Event XVII Investor Conference in Los Angeles on October 29, 2024
Fremont, California--(Newsfile Corp. - October 21, 2024) - Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that President and CEO Gayn Erickson will be presenting at the 17th annual LD Micro Main Event Conference on Tuesday, October 29, 2024 at 2:30 pm PT at the Luxe Sunset Boulevard Hotel in Los Angeles, and will be meeting with investors throughout the day. You may register to watch the presentation here.
加利福尼亚弗利蒙特——(Newsfile Corp. - 2024年10月21日)- 半导体测试和老化设备供应商aehr test systems(纳斯达克:AEHR)今日宣布,总裁兼首席执行官盖恩·埃里克森(Gayn Erickson)将于2024年10月29日星期二下午2:30在洛杉矶的Luxe Sunset Boulevard Hotel参加第17届年度LD Micro Main Event大会,并将全天与投资者会面。您可以在此处注册观看演示。
"I look forward to discussing with investors and shareholders our unique wafer level test and package part burn-in solutions for semiconductor production and the markets they serve, including our recent acquisition of Incal Technology and new high power packaged part reliability/burn-in test solutions that expand our addressable market within the rapidly growing artificial intelligence (AI) semiconductor market," said Mr. Erickson. "Aehr Test provides complete turn-key solutions for improving quality, reliability, and yield of semiconductors such as silicon carbide devices used in electric vehicles and charging infrastructure, gallium nitride devices for multiple power conversion applications, and silicon photonics devices used in data centers and 5G infrastructure and optical input/output (I/O) and co-packaged optics devices as well as AI processors in both wafer level and packaged part device forms. The adoption of wafer level test and packaged parts burn-in of these devices is a significant growth driver for Aehr Test."
“我期待与投资者和股东讨论我们针对半导体生产的独特晶片级测试和封装部件老化解决方案,以及它们所服务的市场,包括我们最近收购的Incal Technology以及新的高功率封装部件可靠性/老化测试解决方案,扩大了我们在快速增长的人工智能(AI)半导体市场中的可寻址市场,”埃里克森先生说。“aehr test systems提供全面的完整解决方案,用于提高半导体(如碳化硅器件用于新能源车和充电基础设施、氮化镓器件用于多种功率转换应用、硅光子器件用于数据中心和5g概念基础设施以及光学输入/输出(I/O)和共封装光学器件以及晶片级和封装部件设备形式中的AI处理器)的质量、可靠性和产量。对这些器件进行晶片级测试和封装部件老化是aehr test systems的重要增长动力。”
The 2024 LD Micro Main Event XVII will be held at the Luxe Sunset Boulevard Hotel in Los Angeles from October 28th to the 30th, and will host 150 companies for two days of presentations and one-on-one investor meetings.
2024年LD Micro Main Event XVII将于10月28日至30日在洛杉矶的Luxe Sunset Boulevard Hotel举行,将邀请150家公司进行为期两天的演示和一对一投资者会议。
About LD Micro
LD Micro aims to be the most essential resource in the micro-cap world. Whether it is the Index, comprehensive data, or hosting the most significant events annually, LD's sole mission is to serve as an invaluable asset for all those interested in finding the next generation of great companies. To learn more about LD Micro, visit .
关于LD Micro
LD Micro的目标是成为微型公司领域最重要的资源。无论是指数、全面数据,还是每年举办的最重要的活动,LD的唯一使命就是成为所有对发现下一代优秀公司感兴趣的人的宝贵资产。要了解更多关于LD Micro的信息,请访问 。
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for Artificial Intelligence (AI) semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turn-key provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at .
aehr@mkr-group.com
总部位于加利福尼亚弗里蒙特,Aehr Test Systems是一家领先的测试解决方案提供商,专为测试、老化和稳定半导体器件而设计,包括片级、独立芯片和封装部件形式,并已在全球安装了数千台系统。半导体的质量、可靠性、安全和安全需求不断增加,适用于多种应用,包括新能源车、新能源车充电基础设施、太阳能和风力发电、计算、数据和电信基础设施,以及固态存储器和存储器,这些驱动了额外的测试需求、增量容量需求,并为Aehr Test产品和解决方案带来新机会。 Aehr已经开发并推出了几款创新产品,包括FOX-PT系列测试和老化系统,FOX WaferPak对准器,FOX WaferPak接触器,FOX DiePak载体和FOX DiePak装载机。FOX-XP和FOX-NP系统是全硅片接触和独立芯片/模块测试和老化系统,可测试、老化和稳定一系列设备,如最尖端的基于碳化硅和其他功率半导体,用于手机、平板电脑和其他计算设备的2D和3D传感器,存储器半导体,处理器,微控制器,片上系统和光子器件和集成光学器件。 FOX-CP系统是逻辑、存储器和光子器件的低成本单硅片紧凑测试解决方案,是FOX-P产品系列的最新成员。FOX WaferPak接触器包含一种独特的全硅片接触器,可测试高达300mm的硅片,使IC制造商能够在FOX-P系统上对整个硅片进行测试、老化和稳定。FOX DiePak载体允许在FOX-NP和FOX-XP系统上测试、烧入和稳定单独的裸片和模块,每个DiePak最多可并行测试1024个设备,最多可同时使用九个DiePak。通过收购Incal Technology,Aehr获得了新的高功率封装部件可靠性/老化测试解决方案系列,用于人工智能(AI)半导体制造商,包括用于AI加速器、GPU和高性能计算(HPC)处理器的超高功率Sonoma系列测试解决方案,将Aehr定位在AI市场快速增长的位置,成为可直接提供从工程到大规模生产的可靠性和测试的提供商。详情请访问Aehr Test Systems的网站。
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Contacts:
联系人:
Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.com
www.aehr.com
Chris Siu
致富金融(临时代码)官
csiu@aehr.com
MKR Investor Relations Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
(323) 468-2300
aehr@mkr-group.com
MKR Investor Relations公司
Todd Kehrli或Jim Byers
分析师/投资者联系方式
(323)468-2300
aehr@mkr-group.com