Broadcom And OpenAI Developing An AI Inference Chip; OpenAI Has Reserved 2026 TSMC Manufacturing Capacity; OpenAI Using AMD Chips Alongside Nvidia Chips
Broadcom And OpenAI Developing An AI Inference Chip; OpenAI Has Reserved 2026 TSMC Manufacturing Capacity; OpenAI Using AMD Chips Alongside Nvidia Chips
博通和OpenAI正在开发一款人工智能推断芯片；OpenAI已经预订了2026年台积电的制造业-半导体产能；OpenAI在使用AMD芯片的同时，也在使用英伟达的芯片
OpenAI is working with Broadcom AVGO.O and TSMC 2330.TW to build its first in-house chip designed to support its artificial intelligence systems, while adding AMD AMD.O chips alongside Nvidia NVDA.O chips to meet its surging infrastructure demands, sources told Reuters.
OpenAI正在与博通AVGO.O和台积电2330.TW合作，设计其首款用于支持其人工智能系统的定制芯片，同时添加了AMD AMD.O芯片，以满足其不断增长的制造行业需求，消息人士向路透社透露。
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