ACM Research Announced A Major Performance Breakthrough For Its Flagship Ultra C Tahoe Cleaning Tool, To Meet Technical Requirements Of Advanced Nodes For Foundry, Logic And Memory Applications For Front-end Semiconductor Manufacturing
ACM Research Announced A Major Performance Breakthrough For Its Flagship Ultra C Tahoe Cleaning Tool, To Meet Technical Requirements Of Advanced Nodes For Foundry, Logic And Memory Applications For Front-end Semiconductor Manufacturing
The Ultra C Tahoe now achieves the performance of standalone single-wafer cleaning tools on low-to-medium temperature sulfuric peroxide mix (SPM) processes. Tahoe's patented hybrid architecture is among the first in the industry to combine batch wafer processing and single wafer cleaning chambers into the same SPM tool. The hybrid architecture delivers enhanced cleaning performance, high throughput, and process flexibility, with up to 75% reduction in chemical consumption. ACM estimates cost savings of up to $500,000 per year from sulfuric acid alone, with additional environmental and cost benefits from reduced sulfuric acid treatment and disposal.
Ultra C Tahoe现在在低至中温硫酸过氧化氢混合物（SPM）工艺上实现了独立的单晶圆清洁工具的性能。Tahoe的专利混合架构是行业中首个将批处理晶圆加工和单晶圆清洁室结合在同一个SPM工具中的架构之一。混合架构提供了增强的清洁性能、高送转和工艺灵活性，化学消耗量最多减少75%。ACm估计单单从硫酸中每年可节省高达50万美元的成本，此外还可从减少硫酸处理和处置中获得额外的环保和经济效益。
